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Chiplets are a relatively recent advancement in semiconductor technology that involves breaking down a traditional monolithic integrated circuit (IC) into smaller, individual semiconductor components or “chiplets.” These chiplets can be designed and manufactured independently, and then they are integrated onto a common substrate or package to create a more complex
Read MoreReading, UK – 17 October 2023. Sondrel (AIM: SND), is pleased to announce that it is one of the founding members of Arm® Total Design, an ecosystem that is committed to bringing Arm Neoverse™ CSS-based designs to market. Arm Neoverse CSS features high-end Arm Neoverse cores that are designed for
Read MoreFlip chip , also known as “controlled-collapse chip connection” (C4), is an advanced semiconductor packaging technique that allows the direct attachment of a semiconductor chip, typically an integrated circuit (IC), to a substrate or circuit board. Unlike traditional packaging methods like wire bonding, in flip chip technology, the active side
Read MoreLAWRENCEVILLE, GA – October 16, 2023 — Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), has been recognized by TSMC as the recipient of the 2023 OIP Partner of the Year Award for Analog/Mixed Signal IP. The OIP Partner of the Year award honors TSMC Open Innovation
Read MoreIn the world of computers, we’re used to thinking in terms of simple “on” and “off” signals, like flipping a light switch. But imagine if your computer could do much more than that—like being in two states at once! This is where quantum silicon chips come into play.
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Meyreuil, France – October 5, 2023 – Presto Engineering, a recognized expert in ASIC design and semiconductor engineering and production services, is pleased to announce its collaboration with Nokia for the industrialization of new equipment designed to build the foundations of the next generation of microwave links as part of
Read MoreMilpitas, CA — Marquee Semiconductor, a leading innovator in the semiconductor industry, is thrilled to announce the establishment of a new location at the Veer Surendra Sai University of Technology (VSSUT) campus, Burla, Odisha in India. This strategic move reinforces Marquee Semiconductor’s commitment to advancing technology and fostering talent in
Read MoreMilpitas, October 2nd, 2023. Marquee Semiconductor, a global leader in chip design solutions, is delighted to announce its collaboration with the Singapore Semiconductor Industry Association (SSIA), a pivotal step that reflects Marquee’s commitment to fostering the growth and advancement of the semiconductor ecosystem in Singapore. SSIA is the voice of
Read MoreBarcelona, Spain – 3 October, 2023. There is an ever-increasing demand for more powerful chip designs for advanced applications, such as AI and ML, that require many cores on one chip. To facilitate this, Semidynamics and SignatureIP have partnered to integrate their respective IPs to provide a fully-tested RISC-V, multi-core
Read MoreICsense has announced its financial results for fiscal year 2022, showcasing a 14% boost in revenue, culminating in a revenue figure of 15.8 Million Euros. Driven by a stream of recurring product income, the company has also significantly enhanced its EBITDA, nearing the 2 Million Euro mark. “This achievement is
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