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Extracted from: Equipment and Materials for Fan-Out Packaging report and Fan-Out Packaging: Technologies & Market Trends, Yole Développement, 2019
“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established in low-end and high-end applications”, asserts Favier Shoo, Technology & Market Analyst at Yole
Nowadays, there is broad consensus in the memory industry that the 28nm/22nm silicon lithography nodes will be the last technology nodes for eFlash[2]. This is not because of fundamental scalability limitations, but because of economic barriers. Therefore a new embedded NVM[3] for code/data storage is needed. At the same time, scaling
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This year’s merger and acquisition announcements are driven by deals in networking and wireless connectivity ICs and by suppliers adding products for automotive systems and other strong-growth end-use markets into the next decade.
After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the number of its SoC design service projects has doubled for three consecutive years. These projects are mainly on 28nm and 40nm nodes featuring lower business entry barrier and competitive production cost compared with the
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HDL Design House and Silvaco Inc. today announced their partnership to offer analog/digital IC design services and full turn-key solutions to fabless semiconductor companies worldwide.
“HDL Design House is a recognized leader in SoC, analog and mixed-signal design services,” said Babak Taheri, CEO of Silvaco. “Offering HDL DH SoC
Moortec, specialists in Embedded In-Chip Monitoring Subsystem IP are pleased to announce that they have appointed Lee Vick as their new Vice President of North America Sales.
Lee will be promoting Moortec’s innovative embedded subsystem PVT IP on 40nm, 28nm, 16nm, 12nm, 7nm and below across the territory, building
Capex spending for memory ICs was the driving factor behind very strong increases in industry-wide capex spending over the past two years. Most of those upgrades and expansion plans are now completed or have entered their final building phases. As a result, memory capex is forecast to account for 43%
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This interview was help with Mr. Oren Beckermus, which is Co-CEO of Beckermus.
Tell me about Beckermus Technologies?
Beckermus Technology is a privately-owned company, I co-own it with my brother, Oded Beckermus, the name of the company as you can already guess comes from our family
September 2, 2019 — Moortec Semiconductor Ltd, providers of complete In-Chip PVT (Process, Voltage and Temperature) Monitoring Subsystems announced today that InnoGrit has chosen Moortec’s 28nm thermal sensing solution to optimise performance and increase reliability for InnoGrit’s recently announced Shasta and Shasta+ SSD controllers aimed at client applications such as consumer electronics
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This interview was held with TRIOULEYRE Jean-Luc, CEO & cofounder of IC’Alps.
Tell me a bit about your background? How did you first get started with IC’Alps?
I started my career as a digital engineer developing FPGA for what became the WIFI. A wonderful experience in
