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Lead Frame Overview
A lead frame is a generic term for a type of (mostly) low-cost IC package assembly used for DIL types packages as well as PLCCs and QFNs.
The frame is typically made of a thin layer of copper, though other materials, such as aluminum
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Belgium, September 26, 2019 – Sofics bvba (www.sofics.com), a leading semiconductor integrated circuit IP provider announced that it has expanded its TakeCharge® Electrostatic Discharge (ESD) and Analog I/O portfolio with solutions for TSMC’s N5 process technology. The cells enable high speed and high frequency interfaces.
Today many communication channels,
Taiwan Semiconductor Manufacturing Company’s heavy investments in advanced wafer-fab technology are set to pay off significantly for the world’s largest silicon foundry as it continues the production ramp of 7nm ICs in the second half of this year, according to an analysis in IC Insights’ September Update to the 2019 McClean Report.
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Neuchatel, 24 September 2019 – CSEM, a leader in low-power RFIC design and embedded systems, announced today at GLOBALFOUNDRIES (GF) annual Global Technology Conference (GTC) that CSEM is developing ultra-low power Bluetooth Low Energy® (BLE), CMOS radar mmWave IP and embedded
machine-learning accelerators on GLOBALFOUNDRIES (GF) 22nm FD-SOI (22FDX®) platform.
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Plymouth, UK, 23rd September 2019 — Moortec, a leading provider of in-chip monitoring and optimisation IP, today announced the availability of its latest In-Chip Monitoring IP Subsystem on TSMC’s N5 and N5P process technologies.
A global acceleration in cutting-edge technologies including 5G, Artificial Intelligence (AI), Machine Learning and Data Centre
Extracted from: Equipment and Materials for Fan-Out Packaging report and Fan-Out Packaging: Technologies & Market Trends, Yole Développement, 2019
“Although the inflated excitement has started to plunge after few years of hype, Fan-Out technologies are still very well established in low-end and high-end applications”, asserts Favier Shoo, Technology & Market Analyst at Yole
Nowadays, there is broad consensus in the memory industry that the 28nm/22nm silicon lithography nodes will be the last technology nodes for eFlash[2]. This is not because of fundamental scalability limitations, but because of economic barriers. Therefore a new embedded NVM[3] for code/data storage is needed. At the same time, scaling
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This year’s merger and acquisition announcements are driven by deals in networking and wireless connectivity ICs and by suppliers adding products for automotive systems and other strong-growth end-use markets into the next decade.
After slowing in the past couple years, semiconductor merger and acquisition activity strengthened in the first
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced the number of its SoC design service projects has doubled for three consecutive years. These projects are mainly on 28nm and 40nm nodes featuring lower business entry barrier and competitive production cost compared with the
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HDL Design House and Silvaco Inc. today announced their partnership to offer analog/digital IC design services and full turn-key solutions to fabless semiconductor companies worldwide.
“HDL Design House is a recognized leader in SoC, analog and mixed-signal design services,” said Babak Taheri, CEO of Silvaco. “Offering HDL DH SoC
