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USA
Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.
Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
View vendor pageIndia
Vervesemi is developing high performance Analog IPs and ASICs for sensors and wireless applications, exploiting the expertise of state-of-the-art data converters and differentiated Analog.
GHz ADC and DAC for 5G, Radar applications, 24b ADC and AFE for sensor, medical, Industrial process control, seismic & metering business, 12b 16b ADC, AFE for embedded microcontroller, precision motor control applications, Mic Bias, 18b Audio ADC and 24b Audio DAC for audio and ANC applications, ADC and DAC for WIFI, Bluetooth, DOSCIS, STB applications, Precision reference, RC oscillator, crystal oscillator, charge pump, LDO, Temperature sensor, Bandgap, power on reset, Charge pump, Programmable gain amplifier, High valued ICs
View vendor pageBelgium
ICsense offers mixed-signal IC design and ASIC supply services for the automotive/aerospace, industrial, consumer and medical markets. The company is ISO9001:2008 and ISO13485 certified with design HQ in Belgium and sales in Japan, U.S. and Germany.
ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety
View vendor pageIsrael
Experts in SMT Assy solution , IC Test sockets and test platforms for engineering teams. High quality , competitive price in a short time line.
USA
MosChip provides turnkey analog, digital and mixed-signal ASIC design, IP design, embedded solutions, product and systems engineering for connectivity, computing, storage, networking, consumer and industrial SoCs. Over the past 2 decades, MosChip has developed and shipped millions of connectivity ICs.
RTL Design, Verification, Analog Layout, Physical Design, System Engineering, Embedded Software/Firmware
Custom SerDes, ARM HSSTP PHY with Link Layer, PCIe PHY, XAUI PHY, CEI SR PHY, SATA PHY
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