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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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Foundry services and foundry adapted IP solutions, Packaging services, Test solutions, Supply Chain
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Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems
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