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Israel
Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.
Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
View vendor pageIsrael
EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
View vendor pageUSA
CSS, a fabless semiconductor leader with 30 years of experience, develops and supplies mixed-signal ASICs to Industrial, Aerospace/Defense, and Medical markets.
Turnkey ASIC Design, Turnkey ASIC Supply, High-Voltage Design, Sensors & MEMS Expertise, Ultra-Low Power Design, Precision Analog & Data Converter Design
Data Converters, RF Circuits, Analog Amplifiers and Comparators, High Voltage Drivers/Interfacing, Serial Communications, Power Management and References
View vendor pageGermany
AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
View vendor pageGermany
TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.
ASIC design and supply chain management, ASIC design services
Video and Graphics, Digital IP, Analog IP
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