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Digital Frontend and Backend from Spec to Silicon, From Wish-list/Spec to Silicon, From wish-list to ASIC Part or PCB Level Solution, Augmenting Customer Team with Specific Expertise, Custom PCB Design, Post Silicon Services, Analog IP, Data Converters (ADC/DAC), Interfaces
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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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PHYSICAL LAYOUT, VERIFICATION, MODELING, PDK DEVELOPMENT, LIBRARY (LAYOUT/ CHAR), EMBEDDED SERVICES
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform
0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)
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