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Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design
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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
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