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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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Teledyne e2v Semiconductors

Teledyne e2v Semiconductors

France

Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.

Services

Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package

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Struent Semiconductors

Struent Semiconductors

India

Struent Semiconductors is a Semiconductors startup based out of India, offering turnkey, Time & Material and custom business models for ASIC/SoC development, specializing in low-power and Lower Technology nodes.

Services

Spec2parts, FPGA Prototyping & Validation, Derivative Chips, Automotive Chips, Chiplets, IP Hardening

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Test Spectrum

Test Spectrum

USA

Test Spectrum is committed to excellence in semiconductor test solutions through dedication to experience, execution and integrity. ITAR Certified.

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Packet Digital LLC

Packet Digital

USA

Packet Digital has a team of skilled engineers ready to help design, verify, and implement your FPGA or ASIC solution. Specializing in analog and mixed-signal designs, the team can take your design from requirements capture to customer delivered silicon.

Services

Analog Circuit Design, Digital & Mixed Signal Design, Verification, Concept to Silicon

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