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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Logic Design (Front-End), ASIC Design RTL to GDS2, Analog & RF Design, Productization, Production, Additional Services
CPU & SoC, Security, General Purpose IP, Analog IP
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Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design
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Design Service, Foundry Access, Testing and Packaging, Turnkey Solution
Interface IPs, Analog IPs, Fundamental IPs, Processor
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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