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XQWave

India

XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.

Services

Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design

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Able

Able Electronics

China

Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.

Services

Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging

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Inpack

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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Tekmos

USA

Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.

Services

FPGA to ASIC Conversion and Replacement, Turnkey ASIC Design and Manufacturing, Legacy Microprocessor Replacement, Analog/Mixed Signal ASIC Design and Manufacturing , Defense, Medical and High Temperature Applications, Legacy FLASH Memory Replacement

IP Cores

Legacy Microcontroller Families, Analog Blocks, FLASH Memory, Serial Interface Modules

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QP Technologies

QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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