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Chip Design and Development, Device Implementation, Turnkey solutions, Speciality funding
12 bit SAR ADC, Digital temperature sensor
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Design Verification, Design Implementation (RTL to GDSII), RTL Design, Design for Test (DFT), Analog & Mixed Signal Design, Emulation and Post Silicon Validation
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Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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ASIC Design , Testing and Packaging, Qualification and Failure Analysis, Supply Chain Management, IoT Operations Outsourcing Solutions, RF and Mixed-Signal Test, Front-end Tape-out, Mask and Wafer Procurement, Back-end Manufacturing and Test, GLOBALFOUNDRIES Channel Partner
RFID analog front-end
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