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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety
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Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
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Supply Chain Management Services – Turnkey Solutions, Engineering services, test program development, Qualification & Reliability investigations, Optomechanical qualifications, Failure & Technological analysis, Device testing, device programming, end-of-line services
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