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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design
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Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform
0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)
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