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USA
Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.
FPGA to ASIC Conversion and Replacement, Turnkey ASIC Design and Manufacturing, Legacy Microprocessor Replacement, Analog/Mixed Signal ASIC Design and Manufacturing , Defense, Medical and High Temperature Applications, Legacy FLASH Memory Replacement
Legacy Microcontroller Families, Analog Blocks, FLASH Memory, Serial Interface Modules
View vendor pageGermany
AEMtec is the Strategic Technology Partner for advanced Microsystems, Opto-Electronics, Wafer back-end and Packaging Services.
Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
View vendor pageIC Design Services, Data converters, Power & Power management, High performance analog, Digital control, Lab validation
SARADC – 37.5 MS/s 12 bit SAR ADC, SARADC – 2MS/s 14 bit SAR ADC w/o Calibration, LLSDADC – High Resolution Low Latency ΣΔ ADC, SDCRDAC – 24 bit Sigma-Delta DAC, CRDAC – 12 bit charge-redistribution DAC, FIRDAC – High Accuracy Low OOBN ΣΔ DAC
View vendor pageUSA
Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.
Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
View vendor pageUSA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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