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The Netherlands
Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.
Packaging & Assembly
View vendor pageFinland
CoreHW is your one-stop custom ASIC solution partner. CoreHW can create your exclusive ASIC in a flash with our broad IP portfolio and partner network. CoreHW is ISO9001:2015 certified company.
IC Design Services, Semiconductor IP & Chip products, Full cycle ASIC and SoC Turnkey Solution , ASIC characterization services, Partner Access
CoreVCO, CorePLL, CorePLL6G, CoreADC, CoreDCDC, Antenna switch, Antennas, CoreHW IPs
View vendor pageUSA
Faststream Technologies is an ASIC design company experienced in Analog IC Design, Digital Backend, Design Verification, Embedded System.
Custom Analog Mixed-Signal ASIC Solutions, ASIC, SoC, FPGA Design Services, Design Verification, Silicon Validation, IC Design Services, DFT Services
Microcontrollers and IDE solution, Custom Memory IP and I/Os, DDR3/DDR2 Memory Controller, 3D Graphics Processor for Wearables/IoT, Gigabit Ethernet PHY Cores, Wired and Wireless Connectivity
View vendor pageIndia
Vervesemi is developing high performance Analog IPs and ASICs for sensors and wireless applications, exploiting the expertise of state-of-the-art data converters and differentiated Analog.
GHz ADC and DAC for 5G, Radar applications, 24b ADC and AFE for sensor, medical, Industrial process control, seismic & metering business, 12b 16b ADC, AFE for embedded microcontroller, precision motor control applications, Mic Bias, 18b Audio ADC and 24b Audio DAC for audio and ANC applications, ADC and DAC for WIFI, Bluetooth, DOSCIS, STB applications, Precision reference, RC oscillator, crystal oscillator, charge pump, LDO, Temperature sensor, Bandgap, power on reset, Charge pump, Programmable gain amplifier, High valued ICs
View vendor pageUSA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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