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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Fabless Semicoductor Supplier, Design Services – Analog & Digital ASIC design, Design Services – FPGAs, Design Services – IC Lifecycle Management – EOL Redesign
Analog IP Cores, Digital IP Cores
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Semiconductor Packaging, Packaging Technology, Design Services, Test Services, Turnkey Services
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ASIC design, ASIC verification, System validation and industrialization , Full turnkey
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