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Israel
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageUSA
EAG's Microelectronics Test and Engineering team provides semiconductor and electronics design firms with test, debug, and early engineering support for new product introduction.
ATE Test and Engineering, Burn-In & Reliability Qualification Services, ESD Testing & Latch-Up Testing Services, PCB Design & Assembly Services, FIB Circuit Edit and Debug Services, Failure Analysis Services
View vendor pageUSA
30 years of cutting-edge mixed-signal design expertise to provide solutions to your most challenging problems.
Turnkey ASIC Design , Post Fabrication – Packaging & Testing, Consultation Services, Custom ROIC & ASIC Design
Column ADC Patent, Extensive IP Library
View vendor pageUSA
SV Probe is an innovative, solutions driven designer that manufactures, markets and services high performance probe cards used within the semiconductor industry.
Cantilever Probe Cards, Vertical Probe Cards
View vendor pageUSA
Neugen provides top notch semiconductor device testing services including silicon debug, device characterization, and production testing.
Test services, SoC Test Systems
View vendor pageItaly
GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.
ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support
View vendor pageUSA
M&M Specialties offers Engineering, Design, Manufacturing and Assembly services for semiconductor specific Test Boards and Test Sockets
Korea
Based in Korea, Hana Micron provides packaging (WLCSP, FlipChip, BGA, SiP, LeadFrame) and test services to the semiconductor industry.
USA
Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.
Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
View vendor pageUSA
Pioneer in the design and manufacture of innovative precision sockets used to test ICs and place them onto PC boards.
Taiwan
We offer the best design manufacturing services for IC packaging, IC substrates, IC testing and systems.
Assembly, Test Service, ASE Turnkey Services
View vendor pageUSA
Our core focus is to provide customers with semiconductor IC testing services they need. Such as ESD & LU testing, Burn-In & Product Reliability, Package Qualifications , Test Hardware and Manufacturing and ATE testing.
IC Qualifications for ESD, Burn-in product, process, Reliability Qualification capability and capacity, Device Package Qualification Services including Preconditioning, Engineering and Hardware capabilities, IC Package Failure Analysis
View vendor pageUSA
Xcerra Corporation is comprised of four businesses in the semiconductor and electronics manufacturing test markets: atg Luther & Maelzer, Everett Charles Technologies, LTX-Credence and Multitest.
China
Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.
Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging
View vendor pageUK
CoreTest Technologies provides a wide array of semiconductor test equipment from sockets to ATE
France
Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
View vendor pageGermany
iC-Haus GmbH is a leading independent German manufacturer of application-specific standard iCs (ASSPs) and customized ASiC semiconductor solutions. Our proprietary cell libraries in CMOS, Bipolar, and BCD technologies are used in smart sensor, laser/opto, and actuator iCs.
USA
GSME is a global provider of customized silicon solutions including RF design, power management ICs, manufacturing operations, and Quality Assurance (QA) to IC design and system companies.
Manufacturing Services, Failure Analysis & Characterization, Design Services
View vendor pageUK
Seamlessly Bridging the Analogue and Digital Worlds for Tomorrow's Chiplet Solutions.
Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting
View vendor pageISE Labs is one of the largest US IC service companies, offering a full spectrum of services related to front and back-end test, with
locations in Austin and Fremont.
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