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Featured Vendor

Sondrel

UK

Sondrel is a System-to-Silicon IC Design Consultancy, providing services for the automotive, IoT, mobile and communications markets from 5 international ISO27001 accredited design centers.

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Amkor Technology Inc.

USA

Turnkey provider of packaging design, assembly and test services. Global operations include +8M ft2 of volume production, development, sales & support.

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CoreHW

Finland

CoreHW is a fabless RF IC Design Service Company, developing state-of-the-art RF integrated circuits to customers worldwide.

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Able Electronics

China

Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.

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Test and Verification Solutions

Test and Verification Solutions

UK

T&VS provides specialist software test and hardware verification solutions to help clients ensure their products are reliable, safe and secure.

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Semiconductor News

Sondrel Expands into India

Sondrel Expands into India

Pure-Play Semiconductor Foundry Growth Is At <40nm Process Nodes

Pure-Play Semiconductor Foundry Growth Is At <40nm Process Nodes

CoreHW accelerates growth – Panostaja invests in CoreHW by purchasing a majority shareholding

CoreHW accelerates growth – Panostaja invests in CoreHW by purchasing a majority shareholding

AFuzion and HDL Design House Joint Webinar: Optimizing DO-254: October 4, 2017, 4 pm CEST

AFuzion and HDL Design House Joint Webinar: Optimizing DO-254: October 4, 2017, 4 pm CEST

Fabless Silicon Manufacture: Should Unit Cost Always Be Minimised?

Fabless Silicon Manufacture: Should Unit Cost Always Be Minimised?

Addressing Clock Tree Synthesis (CTS) Challenges in SoC Designs

Addressing Clock Tree Synthesis (CTS) Challenges in SoC Designs

Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution

Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution

Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box

Shanghai Zhaoxin Semiconductor Co., Ltd. licenses Dolphin Integration ultra dense audio DAC for its next generation of Set Top Box

Latest Articles

ASIC Design

Sondrel Expands into India

Sondrel Expands into India

Sondrel Agrees to Acquire IMG Works Division of Imagination Technologies

Sondrel Agrees to Acquire IMG Works Division of Imagination Technologies

Thermal Issues Associated with Modern ASICs – How Hot is Hot?

Thermal Issues Associated with Modern ASICs – How Hot is Hot?

IP Cores

Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution

Open-Silicon Completes Successful Silicon Validation of High Bandwidth Memory (HBM2) IP Subsystem Solution

Semiconductor IP Market worth $5.63 Billion by 2020

Semiconductor IP Market worth $5.63 Billion by 2020

CSEM licenses IcyTRX™ Bluetooth Low Energy silicon RF IP to Oticon

CSEM licenses IcyTRX™ Bluetooth Low Energy silicon RF IP to Oticon

ASIC Industry Market Trends

CoreHW accelerates growth – Panostaja invests in CoreHW by purchasing a majority shareholding

CoreHW accelerates growth – Panostaja invests in CoreHW by purchasing a majority shareholding

IC Market Forecast 2016 Raised from -2% to +1%

IC Market Forecast 2016 Raised from -2% to +1%

Investment: Fabless Company Acconeer Secures $7.2M

Investment: Fabless Company Acconeer Secures $7.2M

Wafer and Foundries

Pure-Play Semiconductor Foundry Growth Is At <40nm Process Nodes

Pure-Play Semiconductor Foundry Growth Is At <40nm Process Nodes

Intel Announces $7B Investment in Arizona Semiconductor Fab

Number of 300mm Wafer Foundries Increases

Number of 300mm Wafer Foundries Increases

Packaging

Wire-Bond Chip Array BGA — A New Near Die Size Packaging Innovation

Wire-Bond Chip Array BGA — A New Near Die Size Packaging Innovation

STATS ChipPAC Sold to China’s JCET

Comparing Au, Pt, Ag and Cu Wire Bonding

Comparing Au, Pt, Ag and Cu Wire Bonding

Verification

Constrained Random Verification flow strategy

Constrained Random Verification flow strategy

The 4th C in Verification

The 4th C in Verification

Verification IP : Build or Buy?

Verification IP : Build or Buy?

Testing

Presto Engineering Announces Management Expansion

Presto Engineering Announces Management Expansion

Overview and Dynamics of Scan Chain Testing

Overview and Dynamics of Scan Chain Testing

Introduction to LoadBoard Design and Production

Introduction to LoadBoard Design and Production

Qualification

How to bulletproof your ASIC Design

How to bulletproof your ASIC Design

What Is Latch Up and How to Test It

What Is Latch Up and How to Test It

What has IKEA to do with Chip Qualifications based on JEDEC Standards?

What has IKEA to do with Chip Qualifications based on JEDEC Standards?

Supply Chain

Fabless Silicon Manufacture: Should Unit Cost Always Be Minimised?

Fabless Silicon Manufacture: Should Unit Cost Always Be Minimised?

How to Design and Make a Custom Analog IC in 44 Days

How to Design and Make a Custom Analog IC in 44 Days

Packaging and Delivery Methodology for: wafer, die and ICs

Packaging and Delivery Methodology for: wafer, die and ICs

Failure Analysis

Focused Ion Beam (FIB)

Focused Ion Beam (FIB)

Electrostatic Discharge vs Electromigration

Electrostatic Discharge vs Electromigration

Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers

Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers