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Featured Vendors

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

SignOff Semiconductors

USA, India, Israel

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

RAME srl is a fabless ASIC & IP design company specializing in frequency synthesizers, energy-efficient power management and AD converters.

Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Chips&Media is a leading semiconductor HW IP provider specializing in multimedia IPs, video codecs, and deep learning-based upscaling super-resolution.

MinDCet

Belgium

MinDCet specializes in high-voltage, mixed-signal and power ASIC design and possesses internal production testing facilities for comprehensive solutions .

AnaBatIC Semiconductor

Republic of Korea

Anabatic Semiconductor, specialized in BMS(Battery Management System), competitive AFE(Analog Front End, e.g Customized AFE) and wireless BMS.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

RF Semiconductor characterization and training.

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