The Google of the Semiconductor Industry

Micross… The Most Complete Provider of Hi-Rel Microelectronics, Die & Wafer, and Semiconductor Services.

SMIC is one of the leading semiconductor foundries, providing integrated circuit (IC) foundry and technology services at 0.35um to 40nm.

Key ASIC offers turnkey ASIC/SoC design services, specializing in AI, IoT, and medical applications with a focus on PPA optimization.

SkyWater Technology specializes in new technology process development and volume manufacturing ICs for mil/aero, consumer, medical, industrial and automotive markets.

Cyient Semiconductors is a fabless provider delivering custom ASICs, ASSPs, and custom products with end-to-end design and global engineering expertise.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

iSine was founded in 1981 to provide ASIC design, development and manufacturing solutions. Patented LED ballast chips are in production.

XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

Provides our customers unsurpassed service in ASIC design services, analog, mixed-signal and RF design, verification, layout, validation, testing, cost reduction, embedded firmware and applications leading to customer success.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.