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Featured Vendors

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

NTLab

Lithuania

ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Chips&Media is a leading semiconductor HW IP provider specializing in multimedia IPs, video codecs, and deep learning-based upscaling super-resolution.

AI-generated, human-verified RTL for custom designs and IP blocks.

SystematIC Design

The Netherlands

SystematIC is analog, mixed-signal ASIC & system design service company, with proven experience on Sensor Interfacing and Power conversion.

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

ASTC is integral to the global embedded electronics supply chain, supplying semiconductors, IP and software, to OEM and systems companies.

SkyWater Technology specializes in new technology process development and volume manufacturing ICs for mil/aero, consumer, medical, industrial and automotive markets.

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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