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Featured Vendors

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

ASTC is integral to the global embedded electronics supply chain, supplying semiconductors, IP and software, to OEM and systems companies.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Key ASIC

Malaysia

Key ASIC offers turnkey ASIC/SoC design services, specializing in AI, IoT, and medical applications with a focus on PPA optimization.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

SkyWater Technology specializes in new technology process development and volume manufacturing ICs for mil/aero, consumer, medical, industrial and automotive markets.

Kamaten primary business is development and maintenance of Analog and Mixed Signal IP portfolio. We are also a design service provider.

ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

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