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Featured Vendor

Riverbeck

UK

Riverbeck provides turnkey ASIC design and supply solutions, to provide custom integrated circuits where needs or cost demands them.

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Tessolve Semiconductor

USA

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

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NGCircuits

Israel

NGCircuits Ltd. Is an Analog Mixed-Signal design house offering A to Z product supply, IPs and spec. to GDS services.

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EquipIC Supply Chain

The Netherlands

ASIC supply chain partner with competitive solutions for IC manufacturing, packaging and test, lower volumes are welcome too.

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Rochester Electronics

USA

Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.

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Fraunhofer Institute for Integrated Circuits IIS

Germany

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with more than 30 years of experience. Fraunhofer IIS is channel partner of GLOBALFOUNDRIES.

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Semiconductor News

IC Package Types and How to Choose One?

IC Package Types and How to Choose One?

CEO Talk: Bram De Muer of ICsense

CEO Talk: Bram De Muer of ICsense

Multi Project Wafer (MPW) Service and Price

Multi Project Wafer (MPW) Service and Price

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

What does a VLSI Engineer do?

What does a VLSI Engineer do?

What is an ASIC Engineer?

What is an ASIC Engineer?

ASIC Design: From Spec to Chips

ASIC Design: From Spec to Chips

Understanding CoWoS Packaging Technology

Understanding CoWoS Packaging Technology

Latest Articles

ASIC Design

CEO Talk: Bram De Muer of ICsense

CEO Talk: Bram De Muer of ICsense

What does a VLSI Engineer do?

What does a VLSI Engineer do?

What is an ASIC Engineer?

What is an ASIC Engineer?

IP Cores

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

VeriSilicon’s complete Bluetooth Low Energy IP solution is fully compliant with LE Audio specification

QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process

QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries’ 12LP Process

Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core

Noesis Technologies releases its Ultra High Speed FFT/IFFT processor IP Core

ASIC Industry Market Trends

Introduction to eDRAM

Introduction to eDRAM

CEO Talk: Michael Dube, EVP at Rochester Electronics

CEO Talk: Michael Dube, EVP at Rochester Electronics

HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

HaiLa Technologies Showcases First Wi-Fi-based Extreme-low-power Backscatter Chip, Developed in Partnership with Presto Engineering

Wafer and Foundries

Multi Project Wafer (MPW) Service and Price

Multi Project Wafer (MPW) Service and Price

Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023

Global Top 10 Foundries Q4 Revenue Up 7.9%, Annual Total Hits US$111.54 Billion in 2023

Semiconductor Foundry Revenue 2023-2024

Semiconductor Foundry Revenue 2023-2024

Packaging

IC Package Types and How to Choose One?

IC Package Types and How to Choose One?

Understanding CoWoS Packaging Technology

Understanding CoWoS Packaging Technology

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

Verification

The Ultimate Guide to ASIC Verification

The Ultimate Guide to ASIC Verification

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE

Constrained Random Verification flow strategy

Constrained Random Verification flow strategy

Testing

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

First OSAT in the Middle East: Israel Strengthens Semiconductor Independence by Uniting iNPACK Expertise with ATS Engineering

Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing

Presto and T&W Engineering Announce Long-Term Partnership to Advance Wearable Brain Sensing

Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan

Presto Engineering Announces its Collaboration with Nokia as Part of France 2030 Investment Plan

Qualification

Managing Space Grade RF Device Qualifications

Managing Space Grade RF Device Qualifications

Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada

Criteria Labs Expands Manufacturer’s Representatives to Better Serve Customers Throughout the United States and Canada

Understanding High Temperature Storage Life (HTSL) in IC Qualification

Understanding High Temperature Storage Life (HTSL) in IC Qualification

Supply Chain

CEO Talk: Michael Dube, EVP at Rochester Electronics

CEO Talk: Michael Dube, EVP at Rochester Electronics

The Economics of ASIC

The Economics of ASIC

Obsolete Chips – The Ultimate Guide

Obsolete Chips – The Ultimate Guide

Failure Analysis

FIB Circuit Edit

FIB Circuit Edit

Best Practices: IC Troubleshooting & IC Failure Analysis

Best Practices: IC Troubleshooting & IC Failure Analysis

Focused Ion Beam (FIB)

Focused Ion Beam (FIB)