The Google of the Semiconductor Industry

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

Develops electronics for sensors, cameras and image processing. We also offers customized Machine Vision solutions.

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

We deliver industrial ASIC turnkey solutions from specification to mass production, leveraging over 10 foundries including the world's largest.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

Established in 1987, TSMC is the world's largest dedicated semiconductor foundry.

Tekmos delivers ASIC solutions replacing FPGAs, ASICs, Legacy Microprocessors and Flash Memory. Tekmos supports Defense, Medical and High Temperature applications.

Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

ASTC / IQonIC Works is an Australian semiconductor company developing RISC-V microcontroller ICs and application-specific silicon solutions for embedded and industrial applications.