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Featured Vendors

Sigenics Inc. specializes in designing, testing and delivering custom integrated circuits for sensor, analog, and mixed-signal applications within various markets.

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

Chain-IC

The Netherlands

Analog and mixed-signal IC development company based in the Netherlands.

SystematIC Design

The Netherlands

SystematIC is analog, mixed-signal ASIC & system design service company, with proven experience on Sensor Interfacing and Power conversion.

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

Kamaten primary business is development and maintenance of Analog and Mixed Signal IP portfolio. We are also a design service provider.

FortifyIQ develops HW security IP cores fortified against SCA/FIA, while preserving the original AES goals of speed, low latency, and low power usage. We also offer high-performance software libraries and EDA tools for pre- and post-silicon security assessment.

Atek Midas

Turkey

ATEK is a tech company, working on high frequency circuit design. ATEK focuses on providing design and development services from RFIC/MMIC components to Microwave/mm-wave Subsystems based on customer needs.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

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