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Featured Vendors

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Struent Semiconductors is a Semiconductors startup based out of India, offering turnkey, Time & Material and custom business models for ASIC/SoC development, specializing in low-power and Lower Technology nodes.

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Atek Midas

Turkey

ATEK is a tech company, working on high frequency circuit design. ATEK focuses on providing design and development services from RFIC/MMIC components to Microwave/mm-wave Subsystems based on customer needs.

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

InCirT

Germany

InCirT is a German company that provides ultra-wideband data converters, ultra-low jitter programmable PLLs, high-speed interface, and many other IPs.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

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