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Featured Vendors

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

XQWave

India

XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

BTA specializes in ASIC and FPGA design services. We provide team augmentation and turnkey solutions with a high caliber, experienced team.

AAI is a leading provider of complete ASIC design (Front End, Back End and Verification) and turnkey manufacturing services for fabless companies and OEM's, which develops advanced SoC devices.

Allegro DVT

France

Allegro DVT provides Digital Video Compression Solutions, offering Encoder, Decoder, Pixel Processing IPs and industry-standard Compliance Test Suites.

Since 2004, IC Enable has successfully delivered design and layout services with exemplary quality from test chips to full-custom ASICs.

Chips&Media is a leading semiconductor HW IP provider specializing in multimedia IPs, video codecs, and deep learning-based upscaling super-resolution.

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Caliber interconnect Solutions provides full turnkey solutions ,from design through PCB FAB, and local Assembly with the highest industry standards ,for Medical, Military, and Automotive.

Bruco IC is a European fabless analog, mixed-signal and high-voltage IC Design Service company, offering exclusive solutions for the automotive, ISM and consumer market.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

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