TEMPE, Ariz. — Aug. 28, 2025 — Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
The facility will be constructed on a 104-acre site within the Peoria
Kaohsiung, Taiwan – August 13, 2025 — ASE Group (Advanced Semiconductor Engineering), the world’s leading OSAT (Outsourced Semiconductor Assembly and Test) provider, has taken a bold step forward in meeting skyrocketing demand for advanced packaging by acquiring a facility from GaAs foundry WIN Semiconductors. The purchase, approved by the board
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Paris, France – May 19, 2025 – Foxconn Technology Group today unveiled a comprehensive €250 million investment plan in Europe, marking a strategic expansion into advanced semiconductor packaging, satellite manufacturing and electric vehicle production on the continent.
Key Highlights:
Joint Venture in Advanced Packaging: Foxconn will form
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May 13, 2025 —- TrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation. While ASE holdings and Amkor maintained leading positions, OSAT providers from China, such as JCET and HT-Tech,
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The DFN (Dual Flat No-leads) and its counterpart, the QFN (Quad Flat No-leads), are increasingly prevalent in high-performance applications. They’re favored for applications ranging from consumer electronics to automotive systems due to their ability to support advanced circuitry in a small footprint. Familiarizing yourself with these packages’ specifications can dramatically
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Palo Alto, CA – 25 March 2025. Sarcina Technology, a global semiconductor packaging specialist, is excited to announce the launch of its innovative AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform
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