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Featured Vendor

MegaChips Technology America Corporation

MegaChips Technology America Corporation

USA

MegaChips is a trusted partner, delivering technology and expertise that enable products uniquely designed for people and engineered for performances.

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NedCard

NedCard

The Netherlands

NedCard develops semiconductor package solutions and offers related assembly- and test-services for various devices used in smartcard, RFID, IoT, other enabling technologies.

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Tamba Networks

Tamba Networks

USA

Developer of Low-Latency Ethernet and Interlaken semiconductor IP solutions for ASIC, ASSP, and FPGA.

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Terminus Circuits

Terminus Circuits

India

Terminus offers SerDes based transceiver IPs for standards USB.org, PCIe-SIG, IEEE, SATA, VESA etc. Other IPs include clocking and BGR.

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Open-Silicon

Open-Silicon

USA

Open-Silicon provides System-Optimized ASIC Solutions, from Concept to Volume Production.

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Semiconductor News

MCUs (Microcontrollers) Sales History and Forecast 2016-2022
MCUs (Microcontrollers) Sales History and Forecast 2016-2022
How to Calculate your ASIC Unit Cost
How to Calculate your ASIC Unit Cost
Amkor Opens New Semiconductor Package Manufacturing and Test Plant in Taiwan
Amkor Opens New Semiconductor Package Manufacturing and Test Plant in Taiwan
SoC Timing ECO Cycle
SoC Timing ECO Cycle
Sankalp Semiconductor to present technical paper at CDNLive Bangalore
Sankalp Semiconductor to present technical paper at CDNLive Bangalore
Worldwide Location of Wafer Fabs – Interactive Map
Worldwide Location of Wafer Fabs – Interactive Map
Tiannengbo optimises their latest Mining Chip using Moortec’s Embedded Temperature Sensor
Tiannengbo optimises their latest Mining Chip using Moortec’s Embedded Temperature Sensor
NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks
NXP Acquires OmniPHY to Accelerate Autonomous Driving and Vehicle Networks

Latest Articles

ASIC Design

SoC Timing ECO Cycle
SoC Timing ECO Cycle
The case for integrating FPGA fabrics with CPU architectures
The case for integrating FPGA fabrics with CPU architectures
The Future of Custom ASICs
The Future of Custom ASICs

IP Cores

Tiannengbo optimises their latest Mining Chip using Moortec’s Embedded Temperature Sensor
Tiannengbo optimises their latest Mining Chip using Moortec’s Embedded Temperature Sensor
Montage Technology Licenses Allegro DVT’s IP for Next Generation Set-Top Box Chips
Montage Technology Licenses Allegro DVT’s IP for Next Generation Set-Top Box Chips
Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra’s IoT Platform
Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra’s IoT Platform

ASIC Industry Market Trends

MCUs (Microcontrollers) Sales History and Forecast 2016-2022
MCUs (Microcontrollers) Sales History and Forecast 2016-2022
Siemens strengthens IC market commitment with acquisition of Solido Design Automation
Siemens strengthens IC market commitment with acquisition of Solido Design Automation
Physics, Not Economics, will end Moore’s Law
Physics, Not Economics, will end Moore’s Law

Wafer and Foundries

Worldwide Location of Wafer Fabs – Interactive Map
Worldwide Location of Wafer Fabs – Interactive Map
Austria’s ams acquires Heptagon become a worldwide leader in optical sensing
Austria’s ams acquires Heptagon become a worldwide leader in optical sensing
Understanding TSMC’s VCA Program
Understanding TSMC’s VCA Program

Packaging

Amkor Opens New Semiconductor Package Manufacturing and Test Plant in Taiwan
Amkor Opens New Semiconductor Package Manufacturing and Test Plant in Taiwan
Fan-out packaging confirms its success story. What is the next step?
Fan-out packaging confirms its success story. What is the next step?
MEMS packaging market is growing faster than the devices market itself
MEMS packaging market is growing faster than the devices market itself

Verification

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
ASIC Verification: Build or Simulate?
ASIC Verification: Build or Simulate?
Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models
Efficient Verification and Virtual Prototyping of Analog and Mixed-Signal IP and SOCs Using Behavioral Models

Testing

RoodMicrotec reports its strongest first half‐year sales in 7 years
RoodMicrotec reports its strongest first half‐year sales in 7 years
Scan Test Power Normalization Using Hierarchical Test Flow
Scan Test Power Normalization Using Hierarchical Test Flow
CEO Talk: Scott Bulbrook
CEO Talk: Scott Bulbrook

Qualification

Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification
Managing IC Qualification – A Quick Guide
Managing IC Qualification – A Quick Guide
Understanding ESD CDM in IC Design
Understanding ESD CDM in IC Design

Supply Chain

How to Calculate your ASIC Unit Cost
How to Calculate your ASIC Unit Cost
Five Suppliers to Hold 41% of Global Semiconductor Marketshare in 2016
Five Suppliers to Hold 41% of Global Semiconductor Marketshare in 2016
ASIC Model vs. COT Model
ASIC Model vs. COT Model

Failure Analysis

Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Electrostatic Discharge vs Electromigration
Electrostatic Discharge vs Electromigration
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
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