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Featured Vendor

MOSIS

MOSIS

USA

Multi Project Wafer (cost sharing) and Volume Production Service for IC and ASIC designs.

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Wafer Space

Wafer Space

India

Wafer Space is the premier provider of Engineering Design Services in the Semiconductor, Embedded Systems and Application software domains.

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MegaChips Technology America Corporation

MegaChips Technology America Corporation

USA

MegaChips is a trusted partner, delivering technology and expertise that enable products uniquely designed for people and engineered for performances.

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HDL Design House

HDL Design House

Serbia

HDL Design House delivers leading-edge digital, analog, and back-end design and verification services and products in numerous areas of SoC.

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Tusk IC

Tusk IC

Belgium

Tusk IC is a fabless millimeter wave IC design company, providing design services from 10GHz-600GHz in Silicon technologies.

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Semiconductor News

Inomize to present a paper at TSMC OIP Forum in Amsterdam
Inomize to present a paper at TSMC OIP Forum in Amsterdam
HDL Design House Greece Joins HETIA
HDL Design House Greece Joins HETIA
Intel to Acquire eASIC
Intel to Acquire eASIC
GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX® Technology
GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX® Technology
RoodMicrotec reports its strongest first half‐year sales in 7 years
RoodMicrotec reports its strongest first half‐year sales in 7 years
Inomize joins Arm Approved Design Partner program
Inomize joins Arm Approved Design Partner program
China’s Semi Capex Forecast to be Larger than Europe and Japan Combined in 2018
China’s Semi Capex Forecast to be Larger than Europe and Japan Combined in 2018
Silicon Creations’ SerDes Technology Helps Power Leading-Edge 8K TV
Silicon Creations’ SerDes Technology Helps Power Leading-Edge 8K TV

Latest Articles

ASIC Design

HDL Design House Greece Joins HETIA
HDL Design House Greece Joins HETIA
Wireless Transceivers RF CMOS Front Ends
Wireless Transceivers RF CMOS Front Ends
HDL Design House Launches New Website
HDL Design House Launches New Website

IP Cores

Inomize joins Arm Approved Design Partner program
Inomize joins Arm Approved Design Partner program
Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra’s IoT Platform
Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra’s IoT Platform
Highest Performance Interlaken Chip-to-Chip Interface IP Core
Highest Performance Interlaken Chip-to-Chip Interface IP Core

ASIC Industry Market Trends

Inomize to present a paper at TSMC OIP Forum in Amsterdam
Inomize to present a paper at TSMC OIP Forum in Amsterdam
China to invest $47B to build world leading chip company
China to invest $47B to build world leading chip company
The Future of Power Management ICs – PMICs [infographic]
The Future of Power Management ICs – PMICs [infographic]

Wafer and Foundries

GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX® Technology
GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX® Technology
Semiconductor Technology Nodes – History, Trends and Forecast
Semiconductor Technology Nodes – History, Trends and Forecast
Foundry Ranking by Capacity 2013-2014
Foundry Ranking by Capacity 2013-2014

Packaging

eWLB
eWLB
High Bandwidth Memory – White Paper
High Bandwidth Memory – White Paper
Moisture Sensitivity Level and Popcorn Effect
Moisture Sensitivity Level and Popcorn Effect

Verification

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Hierarchical Sequences in UVM
Hierarchical Sequences in UVM
ASIC Verification: Build or Simulate?
ASIC Verification: Build or Simulate?

Testing

RoodMicrotec reports its strongest first half‐year sales in 7 years
RoodMicrotec reports its strongest first half‐year sales in 7 years
VTRAN by Source III Supports Advantest SmarTest 8 Translations
VTRAN by Source III Supports Advantest SmarTest 8 Translations
IDDQ Testing
IDDQ Testing

Qualification

Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding Highly Accelerated Stress Test (HAST) in IC Qualification
Understanding Highly Accelerated Stress Test (HAST) in IC Qualification
What Is Latch Up and How to Test It
What Is Latch Up and How to Test It

Supply Chain

How to Cut Costs, Time and Pain during ASIC Manufacturing
How to Cut Costs, Time and Pain during ASIC Manufacturing
Rambus is Changing Business Model
Rambus is Changing Business Model
SoC Manufacturing and Test Trends
SoC Manufacturing and Test Trends

Failure Analysis

Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Electrostatic Discharge vs Electromigration
Electrostatic Discharge vs Electromigration
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
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