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Featured Vendors

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

Bruco IC is a European fabless analog, mixed-signal and high-voltage IC Design Service company, offering exclusive solutions for the automotive, ISM and consumer market.

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

DXCorr designs memory compilers as well as standard cell libraries to meet the stringent requirements for SoC designs.

Micross… The Most Complete Provider of Hi-Rel Microelectronics, Die & Wafer, and Semiconductor Services.

SMIC

China

SMIC is one of the leading semiconductor foundries, providing integrated circuit (IC) foundry and technology services at 0.35um to 40nm.

Innovative Data Conversion Microelectronics. Our high-performance/low-power data converter IP and other analog/mixed-signal products and design services will shorten your time-to-market.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

Swindon is a leader in the design, production test and supply of industrial and automotive mixed signal ASICs (Custom ICs).

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

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