Featured Vendor

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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Sencio

The Netherlands

Sencio develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

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NGCircuits

Israel

NGCircuits Ltd. Is an Analog Mixed-Signal design house offering A to Z product supply, IPs and spec. to GDS services.

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Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

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Infineon

Germany

Infineon is a world leader in semiconductor solutions, which link the real and the digital world.

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RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

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