The Google of the Semiconductor Industry

30 years producing Semiconductor test solutions (Hardware and Software). Design, Simulation, Manufacture, Assembly, Test Development and more, all by Synergie-CAD.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

ElectraIC develops ASIC / FPGA, microchip and embedded software/systems, electronic circuit design and verification projects.

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Leader in ultra low power analogue and mixed signal ASIC design and IP licensing, including RF, image sensor and SOC.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

DXCorr designs memory compilers as well as standard cell libraries to meet the stringent requirements for SoC designs.

ICsense offers mixed-signal IC design and ASIC supply services for the automotive/aerospace, industrial, consumer and medical markets. The company is ISO9001:2008 and ISO13485 certified with design HQ in Belgium and sales in Japan, U.S. and Germany.

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.