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Featured Vendors

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

Allegro DVT

France

Allegro DVT provides Digital Video Compression Solutions, offering Encoder, Decoder, Pixel Processing IPs and industry-standard Compliance Test Suites.

Cyient Semiconductors is a fabless provider delivering custom ASICs, ASSPs, and custom products with end-to-end design and global engineering expertise.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

SGA

Sweden

SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

Presto Engineering, provides ASIC design and outsourced operations for semiconductor and IoT device companies, helping its customers minimize overhead, reduce risk and accelerate time-to-market.

CAST

USA

CAST develops, sells, and supports digital Silicon IP Cores for ASICs or FPGAs that shorten development time and lower production risk.

Chain-IC

The Netherlands

Analog and mixed-signal IC development company based in the Netherlands.

SMIC

China

SMIC is one of the leading semiconductor foundries, providing integrated circuit (IC) foundry and technology services at 0.35um to 40nm.

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Woodcliff Lake, NJ — October 8, 2026 —Semiconductor intellectual property provider CAST ...
Espoo, Finland – October 5, 2026 – Xiphera announces the launch of ...
WASHINGTON, Oct. 5, 2026 – The Semiconductor Industry Association (SIA) today announced ...
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Advanced packaging has become the place where AI system performance ...
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