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Featured Vendors

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Digicomm Semiconductor is a specialized engineering firm providing advanced end-to-end ASIC design, Packaging, and embedded software services.

Since 2004, IC Enable has successfully delivered design and layout services with exemplary quality from test chips to full-custom ASICs.

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

iSine

USA

iSine was founded in 1981 to provide ASIC design, development and manufacturing solutions. Patented LED ballast chips are in production.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

AnaBatIC Semiconductor

Republic of Korea

Anabatic Semiconductor, specialized in BMS(Battery Management System), competitive AFE(Analog Front End, e.g Customized AFE) and wireless BMS.

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