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Featured Vendors

AI-generated, human-verified RTL for custom designs and IP blocks.

BTA specializes in ASIC and FPGA design services. We provide team augmentation and turnkey solutions with a high caliber, experienced team.

Key ASIC

Malaysia

Key ASIC offers turnkey ASIC/SoC design services, specializing in AI, IoT, and medical applications with a focus on PPA optimization.

Etesian offer a Boutique Foundry support model for Design, manufacturing and sale of high complexity integrated circuit.

Advanced Silicon

Switzerland

Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.

Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.

Digicomm Semiconductor is a specialized engineering firm providing advanced end-to-end ASIC design, Packaging, and embedded software services.

Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

ams OSRAM

Austria

ams OSRAM, a global leader in light and sensor solutions with over 110 years of experience, combines engineering excellence and manufacturing to innovate in sensing, illumination, and visualization across various industries.

ShortLink

Sweden

Specialists in developing silicon designs (ASIC) for portable and wireless applications. Focus on low power and miniaturization with a broad portfolio of IP building blocks.

30 years producing Semiconductor test solutions (Hardware and Software). Design, Simulation, Manufacture, Assembly, Test Development and more, all by Synergie-CAD.

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

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Advanced packaging has become the place where AI system performance ...

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