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Featured Vendors

Chips&Media

Korea

Chips&Media is a leading semiconductor HW IP provider specializing in multimedia IPs, video codecs, and deep learning-based upscaling super-resolution.

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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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Advanced Sensor Integrations

USA

ASI develops custom Analog and Mixed-Signal IC chips & IP blocks. Company is located in San Jose since 2008.

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IMEC

Belgium

Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.

More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.

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Kamaten Technology

Canada

Kamaten primary business is development and maintenance of Analog and Mixed Signal IP portfolio. We are also a design service provider.

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Racyics

Germany

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

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Building a Fabless Semiconductor Business:
In the fast-evolving landscape of semiconductor technology, the term “fabless semiconductor companies”
Chiplet Summit 2025



January 21, 2025 – January 23, 2025
Why should we go
UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance
Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough
Cadence Appoints Moshe Gavrielov to Board of Directors
12 Dec 2024 — SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS)
Apple’s First AI Server Chip to be Engineered in Israel
Dec-12, 2024 — Apple is accelerating its foray into the artificial intelligence
MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
Hyderabad, India — December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have
Chiplet Market set to Reach $411 Billion by 2035
[December 9, 2024] – A groundbreaking new report, “Chiplet Technology 2025-2035: Technology,

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