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Featured Vendors

IMMS GmbH

Germany

Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.

Established in 2003, KAL provides semiconductor deep tech consultancy and ASIC program management. KAL works with worldwide partners to deliver VLSI deep tech development, including digital, RF, and analog ASIC design services, supply chain services, IP cores, and libraries. We are capable of executing full spec to production projects and delivering fully tested ICs in high volume.

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

Since 2004, IC Enable has successfully delivered design and layout services with exemplary quality from test chips to full-custom ASICs.

SignOff Semiconductors

USA, India, Israel

SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.

Aptasic

Switzerland

Aptasic offers turnkey solutions to efficiently handle the ASIC supply chain (from wafer supply to good packaged ICs delivery). The company is ISO 9001:2008 certified (SQS) since 2006.

AAI is a leading provider of complete ASIC design (Front End, Back End and Verification) and turnkey manufacturing services for fabless companies and OEM's, which develops advanced SoC devices.

Chain-IC

The Netherlands

Analog and mixed-signal IC development company based in the Netherlands.

CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.

EnSilica expertise in the design and supply of custom analogue, mixed signal and digital IC’s in the consumer, automotive, industrial and communications markets.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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