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Featured Vendors

Micross… The Most Complete Provider of Hi-Rel Microelectronics, Die & Wafer, and Semiconductor Services.

A leading fabless ASIC / SoC design service and silicon IP provider with 20 years of experience.

CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.

MosChip provides turnkey analog, digital and mixed-signal ASIC design, IP design, embedded solutions, product and systems engineering for connectivity, computing, storage, networking, consumer and industrial SoCs. Over the past 2 decades, MosChip has developed and shipped millions of connectivity ICs.

Know-how and lengthy experience is what makes us successful in the design of analog, digital and Mixed-Signal ASICs. Your partner for future-oriented, Cost-optimized ASIC solutions.

SmartSoC Solutions, a global company providing turnkey solutions for ASIC/SOC and Chip to Product, Digital Design (RTL, Verification, DFT, PD, Emulation, Validation) and Analog Mixed signal IP design (Circuit design and Mask Design).

ChipGlobe

Germany

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

TES is a leading German ASIC Design House and IP company and provides embedded software, hardware, RF and antenna design services.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

We deliver industrial ASIC turnkey solutions from specification to mass production, leveraging over 10 foundries including the world's largest.

ASTC / IQonIC Works is an Australian semiconductor company developing RISC-V microcontroller ICs and application-specific silicon solutions for embedded and industrial applications.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

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Advanced packaging has become the place where AI system performance ...

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