https://www.greenmountainsemi.com/

The Google of the Semiconductor Industry

Find ASIC design, layout and verification vendors:

Find IP Core Vendors:

Find MPW, Mask-Set and Wafer Vendors:

Find IC Package, Assembly and Substrate Vendors:

Find IC Testing, LoadBoard and ProbeCard Vendors:

Find Within All Vendors and Blog Pages:

Find Qualification and Failure Analysis Vendors:

Get prices from vendors within 24 hours Go

or contact us, we will find a vendor that matches you needs

Featured Vendor

RoodMicrotec

RoodMicrotec

Germany

RoodMicrotec provides SCM, Test, Qualification, Failure Analysis and Engineering services to automotive, aerospace, industrial, consumer, medical markets and fabless companies.

View vendor page
Incise

Incise

India

Incise is a technology service provider company with following key focus areas: Semiconductor Digital/Analog ASIC Design & Verification.

View vendor page
Elsys America

Elsys America

USA

ELSYS America provides cost-optimized ASIC, SoC and FPGA design services and solutions, from concept to silicon.

View vendor page
CSEM

CSEM

Switzerland

Leader in ultra low power analogue and mixed signal ASIC design and IP licensing, including RF, image sensor and SOC.

View vendor page
SystematIC Design

SystematIC Design

The Netherlands

SystematIC is analog, mixed-signal ASIC & system design service company, with proven experience on Sensor Interfacing and Power conversion.

View vendor page

Semiconductor News

Enabling security in embedded system using M.2 SSD
Enabling security in embedded system using M.2 SSD
NAND Flash to Lead All Others As IC Market Growth Returns in 2020
NAND Flash to Lead All Others As IC Market Growth Returns in 2020
IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices
IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices
Vehicle autonomy & electrification are pushing the adoption of advanced packaging
Vehicle autonomy & electrification are pushing the adoption of advanced packaging
Moortec’s In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip
Moortec’s In-Chip Monitoring Subsystem Supports Uhnder in Groundbreaking Digital Automotive Radar-on-Chip
Alereon Adopts Omni Design’s Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications
Alereon Adopts Omni Design’s Low Power Analog-to-Digital and Digital-to-Analog Converters for Ultra-Wideband Applications
A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs
A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs
Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk “I-fuse: A Disruptive OTP Technology”
Attopsemi Technology Attended 4th Japan SOI Symposium and Presented a Talk “I-fuse: A Disruptive OTP Technology”

Latest Articles

ASIC Design

IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices
IC’Alps granted ISO 13485:2016 certification for design and supply of Integrated Circuits for medical devices
What is an ASIC and how it is being made?
What is an ASIC and how it is being made?
Thermal Issues Associated with Modern ASICs – How Hot is Hot?
Thermal Issues Associated with Modern ASICs – How Hot is Hot?

IP Cores

Enabling security in embedded system using M.2 SSD
Enabling security in embedded system using M.2 SSD
Providing the lowest-risk path to creating custom SoCs for imaging, video analytics, data center, AI, automotive and industrial markets.
Providing the lowest-risk path to creating custom SoCs for imaging, video analytics, data center, AI, automotive and industrial markets.
Silab Tech Ranked Number 21st Fastest Growing Technology Company
Silab Tech Ranked Number 21st Fastest Growing Technology Company

ASIC Industry Market Trends

Top 15 Semiconductor Sales Leaders – 2019
Top 15 Semiconductor Sales Leaders – 2019
Cadence Mergers and Acquisitions History [infographic]
Cadence Mergers and Acquisitions History [infographic]
proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode
proteanTecs Completes Successful Series B Funding and Launches Out of Stealth Mode

Wafer and Foundries

TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
TSMC and GLOBALFOUNDRIES Announce Resolution of Global Disputes Through Broad Global Patent Cross-License
GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany
GLOBALFOUNDRIES Files Patent Infringement Lawsuits Against TSMC In the U.S. and Germany
Semiconductor Wafer – Overview and Facts
Semiconductor Wafer – Overview and Facts

Packaging

Vehicle autonomy & electrification are pushing the adoption of advanced packaging
Vehicle autonomy & electrification are pushing the adoption of advanced packaging
Mobility Drives Thin Packaging
Mobility Drives Thin Packaging
ASE and Cadence Deliver First System-in-Package EDA Solution Tailored for ASE’s High-Performance, Advanced IC Package Technologies
ASE and Cadence Deliver First System-in-Package EDA Solution Tailored for ASE’s High-Performance, Advanced IC Package Technologies

Verification

Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Sankalp Semiconductor Announces Availability of Automated Analog Validation Services Environment – SAVE
Verification IP : Changing landscape
Verification IP : Changing landscape
10 Essential ingredients for developing VIPs
10 Essential ingredients for developing VIPs

Testing

A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs
A Historical Case for DFT – or how the verification Pilgrims didn’t do their jobs
SoC Manufacturing and Test Trends
SoC Manufacturing and Test Trends
What is a Probe Card?
What is a Probe Card?

Qualification

Understanding High Temperature Storage Life (HTSL) in IC Qualification
Understanding High Temperature Storage Life (HTSL) in IC Qualification
What has IKEA to do with Chip Qualifications based on JEDEC Standards?
What has IKEA to do with Chip Qualifications based on JEDEC Standards?
Understanding ESD HBM in IC Design
Understanding ESD HBM in IC Design

Supply Chain

Presto Adds New Executives to the Leadership Team
Presto Adds New Executives to the Leadership Team
CoreHW and RoodMicrotec to establish long-term supply chain partnership
CoreHW and RoodMicrotec to establish long-term supply chain partnership
Understanding IC Cost
Understanding IC Cost

Failure Analysis

Best Practices: IC Troubleshooting & IC Failure Analysis
Best Practices: IC Troubleshooting & IC Failure Analysis
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Why Dr. Morris Chang is not My Hero. A tribute to Failure Analysis Engineers
Electrostatic Discharge vs Electromigration
Electrostatic Discharge vs Electromigration
Find Vendors IP Cores

Find ASIC Vendors

Find IP Vendors

Get Price Offers From
Welcome New Vendors
Answer a Question
Recent Semipedia Items
Recent Posts
Most Popular Blog Posts
Tools
AnySilicon

Copyright 2011-2019, AnySilicon. All rights reserved.

Follow Us

Semiconductor Services

We use cookies to ensure that we give you the best experience on our website. If you continue without changing your settings, we'll assume that you are happy to receive all cookies from this website.