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Featured Vendors

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

HCLTech

Global

HCLTech is a leading ASIC Design services company with more than 27 years of experience in providing semiconductor services with focus on full Turnkey ASIC design service.

asicNorth provides comprehensive VLSI design services to the semiconductor industry offering a wide range of innovative and well-managed technical solutions.

Silicon Creations provides silicon intellectual property (IP) for precision and general-purpose timing (PLLs), oscillators, low-power, high-performance multi-protocol and targeted SerDes and high-speed differential I/Os.

DA-Integrated is a leading global provider of Comprehensive Production Test Solutions and Custom ASIC Design and Supply.

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Advanced Silicon

Switzerland

Advanced Silicon is a fabless mixed-signal IC solution provider for High-Voltage, High-pin count, and ultra-low noise peripheral SOCs.

Xiphera

Finland

Xiphera develops hardware-based cryptographic IP cores, with a portfolio of 30+ solutions delivering high-performance, future-proof security for mission-critical systems.

AI-generated, human-verified RTL for custom designs and IP blocks.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

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