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Featured Vendors

MinDCet

Belgium

MinDCet specializes in high-voltage, mixed-signal and power ASIC design and possesses internal production testing facilities for comprehensive solutions .

Creonic

Germany

Creonic is the leader in ready-for-use IP cores, offering a rich product portfolio for wired, wireless, fiber and free-space optical communications.

AnaBatIC Semiconductor

Republic of Korea

Anabatic Semiconductor, specialized in BMS(Battery Management System), competitive AFE(Analog Front End, e.g Customized AFE) and wireless BMS.

We deliver industrial ASIC turnkey solutions from specification to mass production, leveraging over 10 foundries including the world's largest.

Xiphera

Finland

Xiphera develops hardware-based cryptographic IP cores, with a portfolio of 30+ solutions delivering high-performance, future-proof security for mission-critical systems.

DA-Integrated is a leading global provider of Comprehensive Production Test Solutions and Custom ASIC Design and Supply.

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

Experior

Malaysia

Experior is dedicated to semiconductor testing. We provide one stop services in test design, development, validation and high volume testing.

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

CAST

USA

CAST develops, sells, and supports digital Silicon IP Cores for ASICs or FPGAs that shorten development time and lower production risk.

BitSim Now

Sweden

Develops electronics for sensors, cameras and image processing. We also offers customized Machine Vision solutions.

RFIC Solutions designs disruptive MMIC SoCs for industries like 5G, Fixed Wireless Access, SATCOM, IOT, Wigig, Wireless Power Transfer, CATV, MIPI, etc. We have expertise in GaAs, GaN, SiGe BiCMOS, Silicon CMOS, other HBT processes as well as hybrid technologies like IPD/LTCC/Thick/Thin film/PCB.

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