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VeriSilicon

USA

“SiPaaS” IP & ASIC solutions including licensable GPU, video, audio, AI/ML-NPU, ISP, compression, security, power, RF, mixed-signal and advanced packaging.

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RADLogic

Australia

RADLogic provides Mixed Signal IC Design Services, IP Block Development and Sales, and Board, Software and System Application Development.

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Silicon Creations

USA

Silicon Creations provides silicon intellectual property (IP) for precision and general-purpose timing (PLLs), oscillators, low-power, high-performance multi-protocol and targeted SerDes and high-speed differential I/Os.

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Fraunhofer Institute for Integrated Circuits IIS

Germany

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

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Chipus Microelectronics

Brazil

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

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Greenvity Communications

USA

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

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Building a Fabless Semiconductor Business:
In the fast-evolving landscape of semiconductor technology, the term “fabless semiconductor companies”
Chiplet Summit 2025



January 21, 2025 – January 23, 2025
Why should we go
UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance
Dec-16-2024 — United Microelectronics Corporation (UMC) (TW:2303) today announced a significant breakthrough
Cadence Appoints Moshe Gavrielov to Board of Directors
12 Dec 2024 — SAN JOSE, Calif.— Cadence Design Systems, Inc. (Nasdaq: CDNS)
Apple’s First AI Server Chip to be Engineered in Israel
Dec-12, 2024 — Apple is accelerating its foray into the artificial intelligence
MosChip selects Cadence tools for the design of HPC Processor “AUM” for C-DAC
Hyderabad, India — December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA
ROHM and TSMC Launch Strategic Gallium Nitride Technology Collaboration for Automotive Industry

ROHM Co., Ltd. (ROHM) announced today that ROHM and TSMC have
Chiplet Market set to Reach $411 Billion by 2035
[December 9, 2024] – A groundbreaking new report, “Chiplet Technology 2025-2035: Technology,

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