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Featured Vendors

ChipGlobe

Germany

ChipGlobe offers ASIC/FPGA Design Services in Design Centers in Munich, Belgrade, Singapore: RTL2GDS, Functional Verification, Embedded Systems + Prototypes.

IMMS GmbH

Germany

Design, verification, and test of analog, digital, and mixed-signal ICs. Specialized in biomedical and optical applications. Premium partner of X-FAB.

Etesian offer a Boutique Foundry support model for Design, manufacturing and sale of high complexity integrated circuit.

SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.

CSEM

Switzerland

Leader in ultra low power analogue and mixed signal ASIC design and IP licensing, including RF, image sensor and SOC.

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

Integra Technologies and its full-turnkey capabilities of die preparation, packaging, testing and characterization of Hi-Rel semiconductor components and related value-added services.

Digicomm Semiconductor is a specialized engineering firm providing advanced end-to-end ASIC design, Packaging, and embedded software services.

Key ASIC

Malaysia

Key ASIC offers turnkey ASIC/SoC design services, specializing in AI, IoT, and medical applications with a focus on PPA optimization.

Bruco IC is a European fabless analog, mixed-signal and high-voltage IC Design Service company, offering exclusive solutions for the automotive, ISM and consumer market.

Neways Advanced Microsystems develops and produces functional plastic encapsulation solutions for MEMS and sensor systems for harsh environments like automotive motor oil applications.

Turnkey provider of packaging design, assembly and test services. Global operations include 11M ft2 of volume production, development, sales & support.

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Woodcliff Lake, NJ — October 8, 2026 —Semiconductor intellectual property provider CAST ...
Espoo, Finland – October 5, 2026 – Xiphera announces the launch of ...
WASHINGTON, Oct. 5, 2026 – The Semiconductor Industry Association (SIA) today announced ...
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Advanced packaging has become the place where AI system performance ...
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