Category Archives: IP Cores

Imec presents 150 GSa/s Digital-to-Analog Converter (DAC) achieving 300 Gb/s data transmission

news

LEUVEN (Belgium), JUNE 11, 2025— This week at the 2025 Symposium on VLSI Technology and Circuits, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, and IDLab, an imec research group at Ghent University and the University of Antwerp, Belgium, announced a significant breakthrough in high-speed digital-to-analog conversion.

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Faraday Unveils FlashKit™-22RRAM: an eNVM-based SoC Development Platform for IoT

press release

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its latest FlashKit™ development platform, FlashKit™-22RRAM, designed to accelerate high-performance IoT and MCU applications. Built on UMC’s 22ULP process, FlashKit™-22RRAM combines embedded Resistive RAM (RRAM、ReRAM) technology with a rich IP ecosystem and development-ready support, providing a

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VeriSilicon’s Ultra-Low Energy NPU Provides Over 40 TOPS for On-Device LLM Inference in Mobile Applications

press release

Shanghai, China, June 9, 2025–VeriSilicon (688521.SH) today announced that its ultra-low energy and high-performance Neural Network Processing Unit (NPU) IP now supports on-device inference of large language models (LLMs) with AI computing performance scaling beyond 40 TOPS. This energy-efficient NPU architecture is specifically designed to meet the increasing demand for

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CAST Expands Functional Safety Line with Additional Certified IP Cores

Woodcliff Lake, New Jersey — June 5, 2025 — Semiconductor intellectual property core provider CAST has added new products to its already-strong line of Functional Safety certified design IP cores.
 
The Functional Safety (FuSa) standard governing automotive systems, ISO 26262, defines Automotive Safety Integrity Levels based on the severity,

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Brite Semiconductor Releases TCAM IP based on 28HKC+ Process

press release chip

Shanghai, China — May 27, 2025 — Brite Semiconductor (Shanghai) Co., Ltd. (BriteSemi, 688691), a leading provider of custom ASIC and IP solutions, today announced the launch of Ternary Content-Addressable Memory (TCAM) IP developed on 28HKC+ 0.9V/1.8V platform. This IP has the features of high frequency and low power consumption. With the

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Analogue Insight and Tetrivis Announce Joint Development of “Eurytion RFK1,” a UCIe based 12 nm Ka/Ku-Band RF Chiplet Transceiver

press release

LONDON & BASINGSTOKE — 23 May 2025 — Analogue Insight Ltd. and Tetrivis Ltd. today unveiled a strategic collaboration to co-develop Eurytion RFK1, a 12 nm RF chiplet transceiver that delivers wide-band Ka/Ku operation with an integrated local oscillator and up to 2 GHz of instantaneous, fully-programmable bandwidth. Leveraging Tetrivis’

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