What is QFP IC Package?
In semiconductor technology, packaging with compact size and high performance is in high demand. Among several discovered semiconductor packaging technologies, Quad Flat Package (QFP) has been vibrant in electronics packaging, as presented in Figure 1.
QFP package is a mature semiconductor packaging technology for
TEMPE, Ariz. & HSINCHU, Taiwan–(BUSINESS WIRE)–Oct. 3, 2024– Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
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BLOOMINGTON, Minn. – September, 2024 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO John Sakamoto, Haddad will build and scale SkyWater’s advanced packaging business serving both the defense
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[Sep 13, 2024] – Foxconn, a leading global electronics manufacturer, and HCL Technologies, a leading Indian technology services company, have taken a significant step towards establishing a semiconductor plant in Uttar Pradesh, India. The joint venture (JV) between the two companies has secured a 30-acre plot of land in Noida, near
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Bac Ninh, Vietnam – September 13, 2023 – Amkor Technology, a leading global provider of semiconductor packaging and test services, has announced significant progress in its operations at its new facility in Bac Ninh, Vietnam. The company, which commenced operations in August 2023, is already experiencing strong growth and contributing to
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today introduced its advanced packaging coordinated platform for the vertical disintegration of chiplets. This unique platform streamlines the advanced packaging processes by integrating multiple vendors and multi-source chiplets and provides three core advanced packaging services – design,
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