Jan. 23, 2026, – Enabling low-cost, low-latency chiplet connectivity for Physical AI at the edge
AALTER, BELGIUM / SAN JOSE, CALIFORNIA – Sofics® bv, a global leader in on-chip electrostatic discharge (ESD) and specialty I/O solutions, today announced a partnership with YorChip Inc., a Silicon Valley startup developing ultra-compact, low-cost chiplets for the emerging Physical AI market.
January 21st, 2026: ICsense, a TDK Group company and leading fab-independent European design group with world class expertise in analog, digital, mixed signal and high voltage integrated circuit design, has opened a new Electronic Wafer Sort (EWS) cleanroom as part of its latest strategic investment programme. With the Application-Specific Integrated Circuit (ASIC) market growing significantly,
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TES Electronic Solutions GmbH adds to its IP portfolio a new VHDL-based PKCS (Public-Key Cryptography) IP core. The IP is designed for System-on-Chip (SoC) implementations and can be integrated into a wide range of applications and target technologies. It supports both ASIC and FPGA designs.
Key Benefits
Comprehensive implementation in accordance with RSA
Meyreuil and Grenoble, France – 22 January 2026 – Scintil Photonics, Presto Engineering and CEA-Leti announce that their joint project, CanopAI, has been awarded funding by the French government under the France 2030 “i-Demo” program supported by Bpifrance. This collaborative initiative reinforces France and Europe’s ambitions to accelerate innovation and strengthen independence in semiconductors, photonics
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TES Electronic Solutions GmbH adds to its Mixed-Signal IP portfolio a new 10-bit SAR ADC IP. The ADC IP is designed for sampling rates up to 125 kS/s and is targeted at integrated diagnosis applications and general measurement use cases with medium accuracy requirements.
The ADC is supplied by 3.3 V. It converts
Jan 13th 2026 — Arm Holdings has reorganized its operations to create a new business unit focused on “Physical AI,” aiming to scale its presence in robotics and automotive computing platforms, company executives told Reuters during CES in Las Vegas.
The move comes as robotics — particularly humanoid robots — emerged as a central