News Archive

Global Memory Market Could Reach $1 Trillion in 2026 as AI Infrastructure Demand Accelerates

press release

June 23rd-2026 —  The global semiconductor memory market is projected to expand dramatically in 2026, driven by surging demand from artificial intelligence data centers and continued constraints on memory supply. According to estimates from Counterpoint Research, worldwide memory revenue could reach approximately $1 trillion in 2026. This would represent more than four times the estimated $240

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Intel and UMC Reportedly Explore 3nm Foundry Collaboration

June 23-2026 — Intel and United Microelectronics Corporation may be considering an expansion of their foundry partnership into advanced-node manufacturing, with a new report claiming that the companies are exploring cooperation on a 3nm process platform. The potential agreement would represent a significant extension of the relationship between Intel and UMC, which currently centres on the

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China’s semiconductor equipment localization enters a new growth phase

chip


KEY TAKEAWAYS



China remains the world’s largest semiconductor equipment market, supported by AI demand, memory expansion, and continued fab investments.
The synchronized expansion of memory leaders CXMT and YMTC is accelerating equipment procurement across key manufacturing segments.
China’s semiconductor equipment localization rate increased from 8% in 2021 to 23.2% in 2025

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TSMC and Amkor Technology Sign 10-Year U.S. Advanced Packaging Agreement

TSMC building

June 19th, 2026 — TSMC and Amkor Technology have signed a 10-year agreement to expand advanced semiconductor packaging and testing capacity in the United States, supporting the development of a more complete domestic chip-manufacturing supply chain.
 
Under the agreement, TSMC will procure advanced packaging and testing services from Amkor. The two companies will also

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Intel Taps Seok-Hee Lee to Lead Advanced Packaging Initiative

June 19th, 2026 — Intel has appointed semiconductor industry veteran Seok-Hee Lee as executive vice president of Intel Foundry, placing him in charge of the company’s advanced packaging, system integration and back-end manufacturing operations.
 
Lee will report directly to Intel CEO Lip-Bu Tan and will lead the development and manufacturing activities associated with advanced

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Samsung Foundry Targets Return to Profitability in 2028

press release wafer

Company outlines restructuring priorities as it strengthens advanced-node production and improves the quality of its customer portfolio.
 
June 17th, 2026 — Samsung Electronics expects its foundry business to remain under financial pressure through 2027, with a return to profitability now considered more likely in 2028.
 
Han Jin-man, president and head of Samsung Electronics’

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