News Archive

Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics

press release

MELVILLE, N.Y., July 28, 2026 – Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today announced that it has entered into a definitive agreement to acquire AEMtec GmbH (“AEMtec”). AEMtec is a

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Amkor Technology Announces Strategic Partnership with NVIDIA to Expand Advanced Packaging and Test for Next-Generation AI Infrastructure

TEMPE, Ariz.–Jul. 23, 2026– Amkor Technology, Inc. (Nasdaq: AMKR) today announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. Under the agreement, NVIDIA will provide a prepayment to support the expansion of Amkor’s U.S. advanced packaging capacity.
 
Advanced packaging enables the performance, energy

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CAST Licenses TCP/IP Hardware Stack Core for Keysight FieldFox Handheld Spectrum Analyzers

Woodcliff Lake, NJ — July 7, 2026 — CAST, a leading provider of high-performance semiconductor IP cores, today announced that Keysight Technologies has licensed CAST’s 1G/10G TCP/IP Hardware Stack IP core for integration into its FieldFox handheld radio frequency (RF) and microwave analyzers.
 
Keysight’s FieldFox family is designed for rugged, portable RF field testing

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TES Electronic Solutions Introduces a Split Pi Boost Buck DC DC Converter IP for X-FAB’s XT018 – 0.18µm BCD-on-SOI technology

press release

TES Electronic Solutions GmbH announces the availability of its new DC-DC converter IP, TS_SPLITPI_3V3_X8, a cascaded 3.3 V boost‑buck converter that can be powered from either a 10 V – 30 V supply or a low-voltage backup battery and is implemented in X-FAB XT018 – 0.18µm BCD-on-SOI technology. The circuit implements the well‑known Split‑Pi topology, offering designers a

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ASICLAND Selected as SK hynix’s Partner for Next-Gen eSSD Development, Establishing a ‘K-Semiconductor Win-Win’ Model

press release


Expanding collaboration in next-generation advanced processes to bolster the competitiveness of the domestic semiconductor ecosystem
ASICLAND extends its scope of collaboration beyond design and verification to the entire productization stage, unlocking opportunities to strengthen its global portfolio
Anticipating organic technological cooperation and mutual growth between conglomerates and SMEs to lead the AI data center

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CAST Introduces PSI5-HOST IP Core for Automotive Sensor Interfaces

Configurable host controller brings robust two-wire PSI5 sensor connectivity to custom automotive SoCs and FPGAs
 
Woodcliff Lake, NJ — June 30, 2026 — Semiconductor intellectual property provider CAST today announced the PSI5-HOST Peripheral Sensor Interface 5 Host Controller IP core, a configurable digital controller that lets ASIC and FPGA developers integrate the ECU side of

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