06 Jan 2026 SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, and high-performance computing (HPC) applications. Initial IP partners joining Cadence include Arm, Arteris, eMemory, M31 Technology, Silicon Creations and Trilinear Technologies,
January 8, 2026 — ASICLAND Co., Ltd., a Korea-based ASIC design solutions provider, announced on January 8 that it has secured a mass production contract in the storage controller segment, marking its first mass-production reference for 2026.
The contract value amounts to USD 17.56 million, with annual production volumes pre-confirmed. Mass production deliveries will be carried
Woodcliff Lake, NJ — January 8, 2026 — CAST, a leading provider of high-performance semiconductor IP, today announced that BAE Systems has licensed CAST’s Time-Sensitive Networking (TSN) IP cores. The selection underscores CAST’s growing role as a trusted supplier of deterministic Ethernet solutions for demanding and safety-critical applications, while marking another milestone for CAST’s TSN technology.
The
TES Electronic Solutions GmbH adds to its IP portfolio a new VHDL-based CAN Flexible Data-Rate (FD) controller IP core. The IP is designed for System-on-Chip (SoC) implementations and can be integrated into a wide range of applications and target technologies. It supports both ASIC and FPGA designs.
Key Benefits
CAN FD Support: Compatible
Kaiserslautern, Germany, January 06, 2025 – Creonic GmbH, the leading provider of ready-for-use IP cores for communication systems, announces an updated version of its SDA OCT IP Core. The new release introduces architectural improvements and extends standard support to simplify system integration and supporting both current and future Optical Communications Terminal (OCT) deployments that have been
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Collaboration aims to accelerate Europe’s adoption of chiplets and advanced 2.5D and 3D chip packaging solutions
December 15, 2025 — Avnet ASIC, a leading provider of ASIC and SoC turnkey solutions, a division of Avnet (NASDAQ: AVT) and a TSMC VCA, together with Bar-Ilan University, announced a strategic collaboration to establish an Advanced Chiplet