News Archive

Volkswagen Begins Development of In-House AI Chip to Regain Ground in China’s EV Market

car

November 6, 2025 — Volkswagen AG (VW) has announced plans to develop its first in-house artificial intelligence chip in China, as part of a broad effort to strengthen its position in the world’s largest and most competitive electric-vehicle (EV) market.
 
The project will be carried out through CARIAD SE, VW’s software subsidiary, in collaboration

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CAST Expands Security IP Line with New Family of Post-Quantum Cryptography Cores

Woodcliff Lake, NJ — November 5, 2025 — Semiconductor IP provider CAST today announced the release of the KiviPQC™ Family — a suite of hardware IP cores that bring quantum-safe cryptography to ASIC and FPGA designs.
 
Implementing the NIST-standardized ML-KEM and ML-DSA algorithms (FIPS 203 & 204), the KiviPQC cores enable system designers to

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RAAAM Memory Technologies Raises $17.5 Million in Oversubscribed Series A Led by NXP Semiconductors

press release

Tel Aviv, Israel — November 5, 2025 — RAAAM Memory Technologies, an Israeli semiconductor startup developing next-generation on-chip memory, today announced it has raised $17.5 million in an oversubscribed Series A funding round led by NXP Semiconductors.
 
The round also saw participation from a leading multinational networking corporation, IAG Capital Partners, the European Innovation

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ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation

CPU chip installed on a computer motherboard



SUNNYVALE, Calif.– Nov 5th, 2025–Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX, TAIEX: 3711), today announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform. The enhanced platform integrates artificial intelligence (AI) to enable faster design iterations, optimize chip-package interaction

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GlobalFoundries Announces €1.1 Billion Investment to Expand Dresden Fab Under Project “SPRINT”

press release chip

Dresden, Germany – November 1st 2025 – GlobalFoundries (NASDAQ: GFS) today announced a major investment of €1.1 billion (approximately US$1.27 billion) to expand its manufacturing capabilities at its Dresden, Germany facility. The expansion, known as Project SPRINT, will enable production capacity of more than one million wafers per year by the end of 2028, reinforcing

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Samsung Begins Mass Production of Advanced 2nm GAA Chips, Strengthening Its Foundry Leadership

press release wafer

Seoul, South Korea – 3rd November 2025 – Samsung Electronics today announced that it has officially begun mass production of its next-generation 2-nanometer (nm) process technology, marking a significant milestone in the company’s advanced semiconductor roadmap. The 2nm process, featuring Gate-All-Around (GAA) transistor technology, positions Samsung at the forefront of nanosheet transistor development, ahead of

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