Mannheim, Germany — May 12, 2026 — EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, announces the availability and readiness for customer integration of the industry´s first 16G UCIe PHY IP in GlobalFoundries´ 22FDX/22FDX+ technology.
The IP marks a significant milestone in chiplet interconnectivity for mainstream foundry nodes. It is optimized for standard
SANTA CLARA, Calif., May 11, 2026 (GLOBE NEWSWIRE) — Building on more than 30 years of collaboration, Applied Materials, Inc. today announced a new innovation partnership with TSMC to accelerate the development and commercialization of semiconductor technologies required for the next era of AI. Working together at Applied’s EPIC Center in Silicon Valley, the companies will co-innovate to advance materials
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WASHINGTON—May 4, 2026—The Semiconductor Industry Association (SIA) today announced global semiconductor sales were $298.5 billion during the first quarter of 2026, an increase of 25% compared to Q4 of 2025. Global sales were $99.5 billion during the month of March 2026, an increase of 79.2% compared to the March 2025 total of $55.5 billion and
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30 April 2026 — TrendForce’s latest foundry industry findings point out that AI demand has surged rapidly since 2023, leading to capacity bottlenecks in 3 nm–2 nm wafers and 2.5D/3D advanced packaging. The shortage of CoWoS has persisted, extending upstream to production equipment and downstream to substrates, packaging materials, and other critical components.
On
MILPITAS, Calif. — April 29, 2026 — The SEMI Silicon Manufacturers Group (SMG) reported today, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025. Sequentially, shipments declined 4.7% quarter-over-quarter from the 3,437 MSI
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TES Electronic Solutions GmbH announces the availability of the Configurable Display Controller (CDC) IP core family, a scalable and modular solution designed to support a wide range of embedded display applications. The CDC enables developers to efficiently manage video- and image-composition, blending, and output in systems ranging from FPGA-based platforms to application-specific ASICs.
The