News Archive

TES offers PKCS IP Core for System-on-Chip (SoC) Designs

chip

TES Electronic Solutions GmbH adds to its IP portfolio a new VHDL-based PKCS (Public-Key Cryptography) IP core. The IP is designed for System-on-Chip (SoC) implementations and can be integrated into a wide range of applications and target technologies. It supports both ASIC and FPGA designs.
 
Key Benefits

Comprehensive implementation in accordance with RSA

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Scintil Photonics, Presto Engineering and CEA-Leti Receive Bpifrance Grant for the CanopAI Project to Advance Photonic Integration for AI and Data Centers

fiber optic

Meyreuil and Grenoble, France – 22 January 2026 – Scintil Photonics, Presto Engineering and CEA-Leti announce that their joint project, CanopAI, has been awarded funding by the French government under the France 2030 “i-Demo” program supported by Bpifrance. This collaborative initiative reinforces France and Europe’s ambitions to accelerate innovation and strengthen independence in semiconductors, photonics

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TES is introducing a new 10-bit SAR ADC IP for XFAB’s XT018 technology.

chip

TES Electronic Solutions GmbH adds to its Mixed-Signal IP portfolio a new 10-bit SAR ADC IP. The ADC IP is designed for sampling rates up to 125 kS/s and is targeted at integrated diagnosis applications and general measurement use cases with medium accuracy requirements.
 

The ADC is supplied by 3.3 V. It converts

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Arm Launches “Physical AI” Unit to Expand Robotics and Automotive Push

irobot

Jan 13th 2026 — Arm Holdings has reorganized its operations to create a new business unit focused on “Physical AI,” aiming to scale its presence in robotics and automotive computing platforms, company executives told Reuters during CES in Las Vegas.
 
The move comes as robotics — particularly humanoid robots — emerged as a central

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Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market

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06 Jan 2026 SAN JOSE, Calif.— Cadence (Nasdaq: CDNS) today announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, and high-performance computing (HPC) applications. Initial IP partners joining Cadence include Arm, Arteris, eMemory, M31 Technology, Silicon Creations and Trilinear Technologies,

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ASICLAND Secures USD 17.6 Million Storage Controller Mass Production Contract

chip

January 8, 2026 — ASICLAND Co., Ltd., a Korea-based ASIC design solutions provider, announced on January 8 that it has secured a mass production contract in the storage controller segment, marking its first mass-production reference for 2026.
 
The contract value amounts to USD 17.56 million, with annual production volumes pre-confirmed. Mass production deliveries will be carried

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