News Archive

Semidynamics Unveils 3nm AI Inference Silicon and Full-stack Systems

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BARCELONA, Spain, Feb. 3, 2026 /PRNewswire/ — Semidynamics today announced its expansion into full-stack AI infrastructure, unveiling a strategic roadmap to deliver high-performance inference silicon and vertically integrated systems. Building on its proprietary architecture, the company is developing chips, boards, and rack-level systems designed for the most demanding AI workloads in next-generation data centers.
 
Breaking the

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Infineon to Acquire ams OSRAM’s Non-Optical Sensor Portfolio for €570 Million

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Munich, Germany Feb-4th-2026 – Infineon Technologies AG has announced a definitive agreement to acquire the non-optical analog and mixed-signal sensor portfolio of ams OSRAM Group for €570 million in a debt-free, cash-free transaction, further strengthening Infineon’s position in automotive, industrial, and medical sensing markets.
 
The acquired business is expected to generate approximately €230 million

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TES is extending its PMU IP portfolio for X-FAB’s XT018 – 0.18µm BCD-on-SOI technology.

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TES Electronic Solutions GmbH expands its Power Management Unit IP portfolio by offering new linear voltage regulator IPs implemented in X-FAB XT018 – 0.18µm BCD-on-SOI technology.          The LDOs can supply a variety of load currents and different regulated output voltages suitable for digital core supply voltages. The following LDO IPs are now available:
 

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YorChip and Sofics Expand UCIe PHY Across TSMC Nodes

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Jan. 23, 2026, –  Enabling low-cost, low-latency chiplet connectivity for Physical AI at the edge
 
AALTER, BELGIUM / SAN JOSE, CALIFORNIA –  Sofics® bv, a global leader in on-chip electrostatic discharge (ESD) and specialty I/O solutions, today announced a partnership with YorChip Inc., a Silicon Valley startup developing ultra-compact, low-cost chiplets for the emerging Physical AI market.
 

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ICsense Increases In-House ASIC Volume Production Capability with Opening of New Electrical Wafer Sort Cleanroom

January 21st, 2026: ICsense, a TDK Group company and leading fab-independent European design group with world class expertise in analog, digital, mixed signal and high voltage integrated circuit design, has opened a new Electronic Wafer Sort (EWS) cleanroom as part of its latest strategic investment programme. With the Application-Specific Integrated Circuit (ASIC) market growing significantly,

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TES offers PKCS IP Core for System-on-Chip (SoC) Designs

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TES Electronic Solutions GmbH adds to its IP portfolio a new VHDL-based PKCS (Public-Key Cryptography) IP core. The IP is designed for System-on-Chip (SoC) implementations and can be integrated into a wide range of applications and target technologies. It supports both ASIC and FPGA designs.
 
Key Benefits

Comprehensive implementation in accordance with RSA

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