SAN FRANCISCO and SUNNYVALE, Calif., Sept. 30, 2026 — Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI capabilities with Synopsys’ industry-leading EDA tools and agentic AI capabilities to revolutionize the design of semiconductors. The companies signed an expansive, multi-year agreement to jointly develop GPT-Synopsys, a specialized model,
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GlobalFoundries’ Singapore manufacturing operations are reportedly running at more than 90% capacity utilization as the foundry expands its silicon photonics footprint to meet rising demand from artificial intelligence, data-center networking and optical connectivity applications. At the same time, the pace of expansion is being challenged by semiconductor equipment lead times, highlighting how AI-related bottlenecks
SUNNYVALE, Calif., Sept. 30, 2026 /PRNewswire/ — Synopsys, Inc. (Nasdaq: SNPS) today announced a strategic agreement with Amazon to accelerate Amazon’s custom silicon innovation and advance the development of increasingly complex AI-powered products and cloud infrastructure. The multi-year agreement marks the expansion of Synopsys’ silicon IP business to serve increasing demand for application-optimized IP with
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ASE Technology Holding is expanding its semiconductor manufacturing footprint in Singapore after its local subsidiary approved the acquisition of a large industrial facility from Lumileds Singapore for approximately US$68.45 million. The transaction comes as ASE continues to increase advanced packaging and semiconductor testing capacity to support growing demand from artificial intelligence, high-performance computing and
29th-Sep-2026 — The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly sophisticated packaging. But another part of the semiconductor supply chain is becoming increasingly important: the analog, mixed-signal and power-management devices required to connect artificial intelligence with the physical world.
That is the market being addressed
September 03, 2026 − Chiplet architectures enable complex systems to be built by combining multiple dies within a single package. For this approach, standardized die-to-die communication is essential. Universal Chiplet Interconnect Express (UCIe) provides a common interface for connecting chiplets and enables scalable integration across different applications.
The Racyics® UCIe PHY IP for GlobalFoundries®