News Archive

Intel Taps Seok-Hee Lee to Lead Advanced Packaging Initiative

June 19th, 2026 — Intel has appointed semiconductor industry veteran Seok-Hee Lee as executive vice president of Intel Foundry, placing him in charge of the company’s advanced packaging, system integration and back-end manufacturing operations.
 
Lee will report directly to Intel CEO Lip-Bu Tan and will lead the development and manufacturing activities associated with advanced

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Samsung Foundry Targets Return to Profitability in 2028

press release wafer

Company outlines restructuring priorities as it strengthens advanced-node production and improves the quality of its customer portfolio.
 
June 17th, 2026 — Samsung Electronics expects its foundry business to remain under financial pressure through 2027, with a return to profitability now considered more likely in 2028.
 
Han Jin-man, president and head of Samsung Electronics’

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Allegro DVT’s Pulsar Decoder IP adds support for AV2 video codec

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June 16, 2025 – Grenoble, France — Allegro DVT, the leader in Semiconductor Video IPs and Video Compliance Tools, announces the availability its real-time AV2 Decoder IP integrated into its Pulsar™ D400 Series Multi-Standard Decoding IP. This milestone is a follow-up to the company’s announcement in September 2026 that underscored its plans to develop solutions for the emerging AV2

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TES offers a new 30V Hysteretic Buck LED Driver IP with precise current control and wide dimming range

chip

TES Electronic Solutions GmbH offers a new LED driver to address the growing demand for reliable LED lighting control in smart home, industrial and automotive environments.
 
The TS_LEDDRV_30V0A5_X8 is a non-synchronous hysteretic Buck LED driver designed to deliver stable current regulation and flexible dimming options for high-voltage LED strings. The IP fits within a

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Analogue Insight Opens Early Customer Engagement for Low-Power 1–32 Gbps NRZ Transmitter and Receiver IP in GlobalFoundries 45SPCLO for Integrated Co-Packaged Optics

chip


IKAIKA45GTX and IKAIKA45GRX IP in GlobalFoundries 45SPCLO support scalable multi-lane links up to 256 Gbps and 512 Gbps; tape-out targeted for Q1 2027.
 


June 15, 2026 – London, United Kingdom —  Analogue Insight announced that its low-power interconnect IP is available for initial customer discussion, evaluation, and customization. Designed in the GlobalFoundries

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Presto Engineering and Menta Announce Strategic Collaboration to Accelerate Adaptive ASIC Architectures with Embedded FPGA Technology

Meyreuil and Sophia-Antipolis, France, June 8, 2026 — Presto Engineering Group, a global leader in application-specific integrated circuit (ASIC) supply and semiconductor services, and Menta, a pioneer and recognized leader in standard-cell-based embedded FPGA (eFPGA) technology, today announced a strategic collaboration to simplify and accelerate the development of adaptive semiconductor architectures by combining Menta’s eFPGA

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