News Archive

CAST Introduces 400 Gbps UDP/IP Hardware Stack IP Core for High-Performance ASIC Designs

press release

Woodcliff Lake, NJ — March 10, 2026 — CAST, a long-established provider of semiconductor intellectual property cores, today announced a new hardware UDP/IP protocol stack IP core that enables data transfer at speeds up to 400 Gbps in ASIC implementations.
 
Designed for standalone operation, the new UDPIP-400G-ASIC core offloads UDP/IP encapsulation and related protocol processing

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SignOff Semiconductors Participates in IESA Vision Summit 2026 – Bengaluru, India

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SignOff Semiconductors participated in the IESA Vision Summit 2026, held on 25–26 February at The Leela Bhartiya City Convention Centre, Bengaluru. Organized by the India Electronics and Semiconductor Association (IESA), the summit brought together leaders from across the semiconductor and electronics ecosystem – including policymakers, global technology companies, startups, academia, and industry experts.
 

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Global Semiconductor Market grows 26% in 2025 to $796 billion

wafer

Global semiconductor sales reached USD 795.6 billion in 2025, representing an increase of 26.2 percent year-over-year and marking one of the strongest annual expansions in the industry’s history. Growth accelerated over the course of the year, culminating in Q4 2025 revenues of USD 238.9 billion, up 38.4 percent compared to Q4 2024, reflecting strong demand across several key

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Faraday Broadens IP Offerings on UMC’s 14nm Process for Edge AI and Consumer Markets

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Hsinchu,  Taiwan, March 3, 2026 — Faraday Technology Corporation (TWSE: 3035), a leading ASIC design and IP provider, today announced the continued expansion of its IP product lines on UMC’s 14nm FinFET Compact (14FCC) platform, covering USB 2.0/USB 3.2 Gen1 PHY, LVDS TX/RX I/O, DDR 3/4 combo PHY (up to 4.2 Gbps), and LPDDR 4/4X/5 PHY

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SK hynix Commits $15 Billion to Expand Advanced Memory Production

press release wafer fab

February 2026 — SK hynix has announced a $15 billion investment aimed at expanding its next-generation memory manufacturing capacity, with a strong focus on High-Bandwidth Memory (HBM) and advanced DRAM technologies to support AI and high-performance computing demand.
 
The investment reinforces SK hynix’s position as a leading supplier of HBM used in AI accelerators

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Meta Turns to AMD as AI Accelerator Competition Heats Up

Latest News

February 2026 — Meta Platforms has announced an expanded deployment of AMD’s Instinct™ data center GPUs as part of its next-generation AI infrastructure strategy. The move represents a meaningful diversification of Meta’s AI compute stack and reinforces AMD’s growing position in hyperscale AI acceleration.
 
Meta will integrate AMD Instinct MI300-series accelerators into its AI

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