News Archive

SignOff Semiconductors Achieves ISO 9001:2015 Certification for Semiconductor Chip Design and Embedded Solutions

DQS Inc.-Issued Quality Management System Certification Covers Bangalore and Hyderabad Operations — Valid Through May 2029
 
May Bangalore, India — SignOff Semiconductors Pvt Ltd, a leading India-based provider of semiconductor chip design, ASIC design, FPGA design, VLSI engineering, and embedded systems services, proudly announces its ISO 9001:2015 certification — the globally recognized benchmark for

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Global Semiconductor Market Surges Beyond USD 1.5 Trillion in 2026 Driven by Extraordinary Memory Expansion

growth

June 2nd, 2026 — Following exceptionally strong results in late 2025 and early 2026, the global semiconductor market is now projected to grow 89.9 percent in 2026, reaching USD 1.51 trillion.
 
The sharp upward acceleration is overwhelmingly driven by the Memory segment, which is forecast to surge by around 250 percent year over year,

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Analogue Insight Appoints Dr Tanya Mangoma as Chief Product Officer to Drive Customer-Led High-Speed Interconnect and Memory Solutions

press release

Semiconductor entrepreneur and compute/memory hardware specialist joins to lead product strategy across AI data centres, automotive and Physical AI platforms, bringing experience across Cambridge neuromorphic research, venture-building at Deep Science Ventures, enterprise AI infrastructure and edge computing.
 
LONDON, United Kingdom, 1 June 2026: Analogue Insight, a UK semiconductor design company specialising in high-speed analogue

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ASE Launches 310mm Panel-Level Packaging Line for AI and Chiplet Applications

chip

Advanced Semiconductor Engineering, better known as ASE, has announced the development of an automated 310mm × 310mm panel-level packaging production line. The move is another sign that advanced packaging is becoming a critical part of semiconductor scaling, especially for AI processors, high-performance computing devices and chiplet-based architectures.
 
For years, the semiconductor industry relied mainly

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ASML Expects First High-NA EUV Chips Within Months as TSMC Delays Adoption Over Cost Concerns

press release wafer





May 26th, 2026 — ASML expects the first semiconductor products manufactured using its next-generation High-NA EUV lithography machines to arrive within months, marking an important milestone for advanced chip manufacturing. The update comes at a time when the semiconductor industry is debating not whether High-NA EUV will be needed, but when

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Intel Begins Work on 10A and 7A Process Nodes as 14A Roadmap Moves Toward Key PDK Release

May 26th, 2026 — Intel is already looking beyond its upcoming 18A and 14A process technologies, with early development reportedly underway for future 10A and 7A nodes. The update signals that Intel Foundry wants to show customers a long-term advanced-node roadmap extending into the next decade, even as the company continues to work through the

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