Aug-10-2026 —
Sony Group and Taiwan Semiconductor Manufacturing Company (TSMC) are reportedly preparing to invest approximately ¥1 trillion ($6.3 billion) in a new joint venture focused on the development and production of next-generation image sensors in Japan.
According to a Nikkei report cited by Reuters, Sony is expected to hold a 60% stake in
Aug-08-2026– The global semiconductor foundry market is showing increasingly clear signs of recovery, although second-quarter results indicate that growth remains uneven across companies and technology segments.
Recent results from TSMC, GlobalFoundries, Tower Semiconductor, Vanguard International Semiconductor, UMC and other foundry manufacturers point to strengthening demand across AI infrastructure, advanced logic, silicon photonics, power management and
Aug-8th-2026 — AMD has agreed to acquire Taalas, a Toronto-based AI chip startup developing highly specialized processors designed to run individual AI models at extremely high inference speeds.
The acquisition adds a new architecture to AMD’s growing AI hardware portfolio and highlights an emerging trend in AI infrastructure: using different types of silicon for different
The World Semiconductor Trade Statistics (WSTS) organization has released Q2 statistical data and confirmed the WSTS Spring forecast for the global semiconductor market through 2029.
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MELVILLE, N.Y., July 28, 2026 – Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today announced that it has entered into a definitive agreement to acquire AEMtec GmbH (“AEMtec”). AEMtec is a
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TEMPE, Ariz.–Jul. 23, 2026– Amkor Technology, Inc. (Nasdaq: AMKR) today announced a multi-year strategic partnership with NVIDIA to develop advanced semiconductor packaging and test technologies for next-generation AI and accelerated computing platforms. Under the agreement, NVIDIA will provide a prepayment to support the expansion of Amkor’s U.S. advanced packaging capacity.
Advanced packaging enables the performance, energy