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Andes Technology Corporation, the leading Asia-based suppliers of small, low-power, high performance 32-bit embedded CPU cores, and XtremeEDA Corporation, a leading North American provider of front-end design and verification services for the semiconductor industry, today announced they will cooperate to develop joint design wins to benefit both companies. Andes will
Read MoreSemiconductor intellectual property provider CAST, Inc. has seen a significant upswing in licenses for the venerable 8051 microcontroller, as today’s designers rediscover that the simplicity, low-power operation, small silicon area, and relatively inexpensive cost of this 8-bit MCU are an excellent match for the demands of many modern products. Specifically,
Read MoreHDL Design House, provider of digital, analog, and back-end design and verification services and products in numerous areas of SoC, will host a joint technical workshop with Mentor, a Siemens business, at the Aviation Electronics Europe conference on June 19th, 2018 at the MOC Event Center in Munich, at 4pm.
Read MoreChipus has been developing battery charger circuits since 2012 and the new IP generation reuses the proven experience of the existing designs with enhanced capabilities.
First generation of battery charger family IP was silicon proven in 2013 in SilTerra 0.18um CMOS and it is capable of dealing with 1.5A
Open-Silicon, a system-optimized ASIC solution provider, today announced that it has achieved ISO 9001:2015 certification. The internationally-recognized certification includes Open-Silicon’s design, manufacture and sales of ASICs utilizing subcontracted wafer fabrication, assembly and test services. This certification is an enhancement from Open-Silicon’s prior ISO 9001:2008 certification and underscores the company’s ongoing
Read MoreT2M, the world’s largest independent global semiconductor technology provider today announced that, Mindtree, will be showcasing their customer proven BQB-qualified Bluetooth Mesh v1.0 software and Bluetooth Low Energy 5.0 Modem, Digital Link Layer, Protocol Stack SW and Profiles IP at Bluetooth Asia 2018 on 30, 31 May at Shenzhen Convention
Read MoreIC Insights will release its May Update to the 2018 McClean Report later this month. This Update includes a discussion of the 1Q18 IC industry market results, an update of the 2018 capital spending forecast by company, and a look at the top-25 1Q18 semiconductor suppliers (the top-15 1Q18 semiconductor suppliers are covered in this research bulletin).
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Presto Engineering Inc., a world leader in semiconductor product engineering and supply chain management, today announced that it has joined GLOBALSOLUTIONS®, GF’s ecosystem of partners that providesservices from conception to production. As an ecosystem partner, Presto will provide its post-silicon engineering and production turnkey solutions based upon GF’s technologies and
Read MoreDolphin Integration, a major leader in energy efficient Systems-on-Chip, has announced it has recently joined the RISC-V Foundation.
The RISC-V Foundation, a non-profit corporation controlled by its members, directs the future development and drives the adoption of the RISC-V ISA. Originating in academia and research, RISC-V is a free
The spread of digital camera applications in vehicles, machine vision, human recognition and security systems, as well as for more powerful camera phones will drive CMOS image sensor (CIS) sales to an eighth straight record-high level this year with worldwide revenues growing 10% to $13.7 billion, following a 19% surge
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