Semiconductor Latest News

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Sonics Collaborates with GLOBALFOUNDRIES to Accelerate Adoption of Power and Performance Capabilities of the 22FDX® Process by SoC Designers

San Jose, Calif. – January 25, 2017 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced it will collaborate with GLOBALFOUNDRIES on energy processing unit (EPU) product development that leverages the power and performance optimization capabilities of the 22FDX® process

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The Ultimate Guide to Wafer Sort

You may have heard of wafer sort or wafer testing, which is a part of the testing process performed on silicon wafers. Wafer sort is a simple electrical test, that is perform on a silicon die while it’s in a wafer form. Wafer sort’s main purpose is to identify the

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Dolphin Integration Receives Open-Silicon’s Award for the Emerging IP Partner of the Year 2016 in the Low Power IoT Ecosystem

The industry’s focus on battery-powered devices sets new expectations in terms of energy saving for a wide range of applications such as IoT, wearables and wireless MCUs. Meeting the underlying low-power challenge requires a new class of silicon IPs to enable unmatched power consumption figures and new IoT SoC architectures

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Faraday: World’s First ISO 26262 Certified ASIC Service Company

Hsinchu, Taiwan — Jan. 19 2017 — Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, has received the certificate of ISO 26262 (Road vehicles-functional safety) from SGS-TÜV Saar on its design development process. Faraday is the first ASIC design service company in the world approved

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eInfochips Positioned in the Leadership Zone for Semiconductor Services

eInfochips, a leading Product Engineering and Software R&D services firm, recently announced that the company was rated in the “Leadership Zone” for Semiconductor services by Zinnov, in its annual “Zinnov Zones 2016 PES” ratings. eInfochips was also recognized under “Execution Zone” for Aerospace, Industrial Automation, Medical Devices, and Consumer Software.
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Silicon Wafer Integrated Fan-out Technology Packaging for Highly Integrated Products

The continued growth of the mobile handset, tablet, and networking markets requires ongoing development of innovative packaging technologies. The required solutions must provide reduced form factor and high thermal and electrical performance as well as increased functional convergence and system integration. To meet the extremely small interconnect feature sizes in

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X-Fab, SMIC, and TowerJazz each grew by ≥30% in 2016

The pure-play semiconductor foundry market is forecast to play an increasingly stronger role in the worldwide IC market during the next five years, according to IC Insights’ new 2017 McClean Report, which becomes available later this month.  The 20th anniversary edition of The McClean Report forecasts that the 2016-2021 pure-play

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Fabless Silicon Manufacture: Supplier Relationships Matter

When someone contributes to the success of your product, but they don’t work directly for your company, why should they work as hard as your employees ? Your employees, and to a smaller extent your suppliers, obviously have a financial interest in your company’s success. But success takes more than

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Faraday Readies MCU ASIC Migration Path with 55nm eFlash

Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced its 55nm eFlash-based ASIC solution is ready to support better MCU performance. By skipping 90nm, Faraday’s MCU ASIC path strides directly from 8-inch 0.11μm to 12-inch 55nm eFlash process node, offering much lower power/leakage and

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AnSem expands operations in Enschede, The Netherlands

Leuven, December 20th 2016 – AnSem NV, the leading analog, RF and mixed-signal ASIC solutions company expands its operations, opening an office in Enschede, The Netherlands.
 
The Dutch design center will be headed by Clemens Mensink, who has over 20 years of IC experience. AnSem BV will be located

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