Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Lately, there’s been a lot of buzz about silicon photonics in the data center industry. What’s it all about? The ever-expanding digital universe is being driven by cloud computing, mobile data, video streaming, and Internet-of-Things (IoT). Today, it’s estimated that by end of 2016, more than 6 zettabytes (i.e., the
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QFN package is the most successful package type today. Offering low price, excellent performance and small size, it is an ideal package for many applications.
QFN package comes in different size and different lead count. This infographics shows the most popular body size and lead count provided by leading OSAT
Some years ago the term “System On a Chip”, shortened to “SOC”, was coined to describe chips that integrated into themselves the functions of several other chips in an electronic system. The point of this was obviously to reduce cost and form factor in situations where the cost and effort
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This is an interview with Oliver King about understanding your ASIC’s age. As Moortec’s CTO, Oliver has been leading the development of compelling in-chip monitoring solutions to address problems associated with ever-shrinking System-on-Chip (SoC) process geometries. An analogue and mixed signal design engineer with over a decade of experience in low
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Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and
IP provider, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303)
(“UMC”), a leading global semiconductor foundry, today announced the
availability of Faraday’s 12.5Gbps programmable SerDes PHY IP on UMC’s 28HPC(U)
process technology. The success of Faraday’s 12.5G SerDes PHY
According to Gartner, the total average IC design cost for a 14nm chip is about $80 million, compared to $30 million for a 28nm planar device. Whilst many vendors will remain at 28nm, the ‘big guys’ have forged ahead with migrating to lower technology nodes. At the leading edge, R&D
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STMicroelectronics, (NYSE: STM) , a global semiconductor leader serving customers across the spectrum of electronic applications, today announced that it has acquired ams’ (SIX: AMS) assets related to NFC and RFID reader business. ST has acquired intellectual property, technologies, products and business highly complementary to its secure microcontroller solutions serving mobile devices,
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AnySilicon, the fastest-growing semiconductor vendors platform has announced today the availability of its free Semiconductor Package Price Estimator which provides package price for all major semiconductor packaging type.
Using this free tool, companies can get quick price estimation for the packaging and assembly prices which are becoming critical in many
Kandou Bus, S.A., the world’s highest performance and lowest energy SerDes technology company, has announced that it has completed a $15M investment with Bessemer Venture Partners. The resources will enable Kandou to expand research and accelerate the development, productization and deployment of Kandou’s Chord™ signaling SerDes technology. Kandou has developed
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Students around the world now have free access to the same leading engineering simulation solutions used by top organizations and professional engineers to create the most advanced products on the planet, thanks to ANSYS (NASDAQ: ANSS).
Released today, ANSYS® Student is a free, introductory academic software package for