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Heterogeneous integration offers a solution by allowing different materials and components to work together seamlessly, driving innovation in various applications. This approach not only enhances system performance but also enables the development of sophisticated electronic devices that are smaller, faster, and more efficient.
Understanding heterogeneous integration requires a grasp
MELVILLE, N.Y., Jan. 15, 2025 /PRNewswire/ — Micross Components, Inc. (“Micross” or the “Company”), a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies (“Integra”). Integra is an Outsourced Semiconductor
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SCOTTSDALE, Ariz. – Dec. 9, 2024 – onsemi (Nasdaq: ON) today announced that it has entered into an agreement to acquire the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash. The acquisition will complement onsemi’s extensive EliteSiC
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Chip Scale Packaging (CSP) emerges as a groundbreaking solution that optimizes space while enhancing performance in the realm of microelectronics. This innovative packaging method is transforming how devices are designed and manufactured, impacting various industries.
Chip Scale Packaging is characterized by its compact size, which allows for
The semiconductor industry stands at the forefront of innovation and change. From the smartphones in our pockets to the autonomous vehicles of the future, semiconductors are the critical building blocks that drive progress across various sectors. Understanding the trends shaping this industry is essential for grasping the future of technology.
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Woodcliff Lake, New Jersey — January 16, 2025—CAST, a leading semiconductor intellectual property (IP) core provider, is excited to announce the upcoming release of its new KiviPQC™-KEM IP core and invites early adopters to engage in product evaluations. This new IP core implements the Module-Lattice Key Encapsulation Mechanism (ML-KEM) as
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BLOOMINGTON, Minn. – January 15, 2025 – SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the launch of ThermaView℠ Solutions, a complete suite of services and technologies designed to meet the evolving needs of thermal imaging system designers. These solutions will deliver capabilities to support development and production of state-of-the-art,
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SAN RAMON, CA, UNITED STATES, January 14, 2025 — YorChip, Inc. and Chipcraft announce development of a low cost, low power 8 bit 200Ms/s ADC Chiplet. Currently no ultra-low power devices exist in open market as Chiplets. Designers currently have to license the IP and integrate into a custom SOC while
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January 13, 2025 — The National Aeronautics and Space Administration (NASA) awarded four contracts in 2024 to Alphacore to advance the development of cutting-edge microelectronics systems to support space and other missions. Alphacore, a leader in analog, mixed-signal, and RF integrated circuit design intellectual property, excels in creating high-performance, low-power designs
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HSINCHU, Taiwan, R.O.C. – Jan. 10, 2025 – TSMC (TWSE: 2330, NYSE: TSM) today announced its net revenue for December 2024: On a consolidated basis, revenue for December 2024 was approximately NT$278.16 billion, an increase of 0.8 percent from November 2024 and an increase of 57.8 percent from December 2023. Revenue
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