Get the semiconductor daily news directly to you by subscribing to our email list. For ASIC designer and managers, staying updated with the latest news, technologies, and trends is crucial. Here are the lastest news from the semiconductor industry.
Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, and Kiwimoore, a global leader in AI networking full-stack interconnect products and solutions, announced today that their jointly developed 2.5D packaging platform has successfully entered the mass production stage. The one-stop advanced packaging platform and service developed
Read More
Samsung Foundry is accelerating its efforts to establish mass production capabilities for its 2nm process technology, according to industry sources. The company is actively equipping its “S3” foundry line at the Hwaseong plant, aiming for a monthly capacity of 7,000 wafers by Q1 2024. Further expansion is planned with the
Read More
Global semiconductor sales soared to a record $53.1 billion in August, marking a significant 20.6% year-over-year increase, according to the Semiconductor Industry Association (SIA). This surge, the highest since April 2022, underscores the robust momentum in the semiconductor industry, driven primarily by the burgeoning demand from the artificial intelligence (AI)
Read More
What is QFP IC Package?
In semiconductor technology, packaging with compact size and high performance is in high demand. Among several discovered semiconductor packaging technologies, Quad Flat Package (QFP) has been vibrant in electronics packaging, as presented in Figure 1.
QFP package is a mature semiconductor packaging technology for
Introduction to Semiconductor
Semiconductors have a small energy gap between the conduction and valance bands, and their conductivity is between insulators and conductors. At absolute zero temperature, semiconductor materials are pure insulators and gradually increase with temperature. Temperature and doping are the two mechanisms to manage the conductivity of semiconductors.
TEMPE, Ariz. & HSINCHU, Taiwan–(BUSINESS WIRE)–Oct. 3, 2024– Amkor Technology, Inc. (Nasdaq: AMKR) and TSMC (TWSE: 2330, NYSE: TSM) announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.
This press release features multimedia. View the full
[Santa Clara, USA], [October 3rd, 2024] – MosChip® Technologies, a semiconductor design and product engineering services company, is excited to announce the launch of MosChip DigitalSky™, a comprehensive suite of digital solutions aimed at transforming global enterprise into a connected and intelligent entity. It enables organizations to thrive in the
Read More
Taipei, Taiwan – October 2, 2024 – Powerchip Semiconductor Manufacturing Corporation (PSMC), a leading Taiwanese foundry, has announced a strategic shift in its global expansion plans, opting to scrap a previously announced semiconductor fab project in Japan in favor of building a new fab in Gujarat, India. The decision comes
Read More
Tokyo, Japan – October 2, 2024 – Toppan Photomask, a global leader in the semiconductor photomask industry, will officially change its name to Tekscend Photomask on November 1, 2024. The rebranding represents a strategic move to reflect the company’s ongoing commitment to technological innovation and growth as a premier photomask
Read More
Beijing, China – October 2, 2024 – China’s integrated circuit (IC) exports have experienced a remarkable recovery in 2024, showing strong growth despite recent global downturns in the semiconductor industry. According to customs data reported by People’s Daily, IC exports from China in the first eight months of 2024 reached
Read More