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USA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
View vendor pageUSA, India
SignOff Semiconductors is having best-in-class expertise in all aspects of ASIC / SOC Design Services from spec-to-silicon.
Physical Design, STA & Synthesis, Flow Development, RTL Design & Integration, DFT, Design Verification, Circuit and Layout Design, Turnkey Solutions / IP Services
View vendor pageLithuania
ASIC design service and silicon IP provider specializing in analog/mixed-signal and RF design (GNSS, RFID, telecom, medical, sensors).
Turnkey ASIC Design, IP Blocks Design, Radioelectronic Devices Development
RF Transceivers, PLL, ADC, Process, Voltage and Temperature Sensors (PVT sensor/detector/controller), RFID (UHF tag, ID card, NFC, medical implants), Energy harvesting (power converters from RF-field to voltage and current)
View vendor pageUSA
Mirafra is a global Engineering Services company with expertise in Semiconductor Design & Verification, Embedded and Application Software services.
Design Verification, Design Implementation (RTL to GDSII), RTL Design, Design for Test (DFT), Analog & Mixed Signal Design, Emulation and Post Silicon Validation
View vendor pagePIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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