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USA
Application-Specific Integrated Circuit (ASIC) design services, IP and turnkey solutions since 2006. Our ASICs include analog, mixed-signal and digital functionality.
Digital Frontend and Backend from Spec to Silicon, From Wish-list/Spec to Silicon, From wish-list to ASIC Part or PCB Level Solution, Augmenting Customer Team with Specific Expertise, Custom PCB Design, Post Silicon Services, Analog IP, Data Converters (ADC/DAC), Interfaces
View vendor pageGlobal
HCLTech is a leading ASIC Design services company with more than 27 years of experience in providing semiconductor services with focus on full Turnkey ASIC design service.
ASIC/FPGA Design Services, Analog & Mixed Signal Design, Custom Layout, Digital Design Services, Foundry Services, Post Silicon Validation Services, SoC Turnkey Design
IP Marketplace
View vendor pageIndia
XQWave is a semiconductor consulting firm delivering end-to-end ASIC, embedded, and silicon solutions with deep industry expertise and proven execution.
Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design
View vendor pageBelgium
Imec.IC-link is the semiconductor manufacturing division of imec. We help innovators, entrepreneurs and universities realize their ideas in silicon by providing low-cost prototyping, volume production and system integration of electronic assemblies.
More than 500 IC projects tape-out a year. Co-work with more than 300 companies and more than 700 universities.
ASIC, SOC design, Foundry services, Turn key (supply chain management), Package and testing , TSMC’s official VCA (Value Chain Aggregator) , MPW and mini ASIC Services
View vendor pageFrance
Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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