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Inpack

iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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GEDEC

Italy

GEDEC (GEnova DEsign Center) is an independent electronic system and integrated circuit design house, mainly focused in advanced electronic and ICs microelectronics design.

Services

ICs Design Service, ICs Layout Design Service, Power Management Circuit Consulting and Development, Analog Layout Resource Rraining, Automatic Test Equipment Full Support

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EASii IC

France

EASii IC is a design house developing high performances ASIC, from 0.35µm down to 10nm, including FD-SOI.

Services

ASIC design, ASIC verification, System validation and industrialization , Full turnkey

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Chipus Microelectronics

Brazil

Chipus (ISO 9001:2015 certified) provides full turnkey ASIC solutions, analog and mixed signal IP and design services in analog (design and layout) and digital domains (Modeling, RTL coding, verification and backend).

Services

Full turnkey ASIC, IC design services, Analog and mixed signal IP, Supply Chain Management, Team augmentation

IP Cores

Power Management, Data Converters, Clock Management, Sensors , Front Ends

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racyics

Racyics

Germany

Racyics is an experienced integrated circuit design service provider and GLOBALFOUNDRIES channel partner with focus on advanced semiconductor nodes.

Services

Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform

IP Cores

0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)

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