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Packaging & Assembly, Electrical Wafer Sort & Final Test, Qualification & Failure Analysis, Fast-turn IC Assembly & Prototyping, Long-term Storage – Thermal-Absorptive Gas-Barrier, Back-end Turnkey Solutions – OSAT Services
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Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting
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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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