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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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ASIC design and supply, IC design services , ASIC business case validation, Sensor/MEMS interfacing, Power management, High-Performance and low power, High-voltage design, Test and packaging, Industrialisation, Supply Chain Management, Functional safety
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Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems
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Front End Design, Design Verification, Physical Design & Sign Off, Design for Testability (DFT), FPGA Design, Analog Design
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ASIC design, ASIC verification, System validation and industrialization , Full turnkey
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