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France
Teledyne e2v offers a range of semiconductor services, including high-reliability assembly and test, high-performance package design and long-term support.
We are specialist of flip-chip assembly for the space market, including very large dies. We offer hermetic ceramic assembly or organic.
Our plant is QML-V and QML-Y certified.
Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
View vendor pageUSA
Rochester provides a range of manufacturing services, such as wafer storage, die processing, design, assembly, electrical testing, failure analysis, and reliability testing.
Wafer Storage & Processing, Assembly Services, Electrical Test Services, Analytical Services, Reliability Testing
View vendor pageUK
Linwave Technology based in the UK offers a range of standard QFN limiter LNAs, detectors and customised multi-chip modules for defence, marine and automotive and industrial applications.
Israel
EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.
Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management
View vendor pageThe Netherlands
Bruco IC is a European fabless analog, mixed-signal and high-voltage IC Design Service company, offering exclusive solutions for the automotive, ISM and consumer market.
Smart Integrated Power, Wireless Communications, RF-Energy, Characterization and Testing, EDA, Consultancy and Training Services, Supply Chain Management, Certifications
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