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Fabless Semicoductor Supplier, Design Services – Analog & Digital ASIC design, Design Services – FPGAs, Design Services – IC Lifecycle Management – EOL Redesign
Analog IP Cores, Digital IP Cores
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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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SoC Verification, IP Level Verification, FPGA Prototyping, ASIC Implementation
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