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Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems
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ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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PIC Design Service, PIC Consultancy Service, PIC Testing Service (Die and Wafer level), PIC Packaging Service, PIC Manufacturing Service, PIC Training Service
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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