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Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting
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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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AI Circuit Design, Analog & Mixed Signal Design, Emerging Memory Development, Special Purpose Applications, Interface Solutions
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Turnkey ASIC Design, IP Blocks Design, Radioelectronic Devices Development
RF Transceivers, PLL, ADC, Process, Voltage and Temperature Sensors (PVT sensor/detector/controller), RFID (UHF tag, ID card, NFC, medical implants), Energy harvesting (power converters from RF-field to voltage and current)
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