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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis
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Spec2parts, FPGA Prototyping & Validation, Derivative Chips, Automotive Chips, Chiplets, IP Hardening
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RTL Design and Verification, Design Verification, Design For Test, Physical Design, Static Timing Analysis, Post Silicon Validation
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Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform
0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)
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