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Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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SoC Verification, IP Level Verification, FPGA Prototyping, ASIC Implementation
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Turnkey ASIC / SOC Development, Technology Development Platform, Technology Development Platform, Analog Circuit Design, Integrated Circuit Layout, Digital Design (RTL Design) and Verification, Digital Physical Design
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RTL Design, RTL Design Verification, DFT, Netlist to GDS, Analog Circuit and Layout, Post Silicon Services
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