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ASIC Design, ASIC Production Testing, Measurement Systems
GaN Gate Driver, SiC Gate Driver
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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Partnership Programs, Standard Chiplet Design, Custom SoC and IP Design & Licensing, Comprehensive Design Services, Consulting
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