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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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ASIC Design, ASIC Production, ASIC Production Management, Replacement of Obsolete Components
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IC/SoC design, Fabrication, Packaging & Testing, SYSTEM SOFTWARE, IOT SERVICES
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Intellectual Property (IP) & Process Technology, SoC/ASIC Development Platform, Design Flow, Packaging & Testing, Production Service, Application-Oriented Value-Added Services
USB3.1 Gen1 IP Solutions, Technology Optimized Standard Cell Library, ESD Robust Multi-Voltage I/O, Low Power SRAM with High Production Yield
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Design Execution, AMS Circuit Design, Reliability & Product Engineering, Embedded Software, Low-Cost ASIC
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