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QP Technologies

QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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ekss Microelectonics LTD

E.K.S.S Microelectronics

Israel

EKSS Microelectronics was established in 2002 and provides Complex IC Product and Test Engineering, Assembly,Supply Chain Services & Consultancy to the Fabless Semiconductor & IC Design House community.

Services

Test Engineering, Package Design / Selection, IC Reliability Tests Management, Supply Chain Management

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SGA

SGA

Sweden

SGA designs and manufactures mixed-signal, full-custom ASIC's for primarily industrial applications world-wide.

Services

ASIC Design and Supply, Analog and mixed-signal circuits

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Packet Digital LLC

Packet Digital

USA

Packet Digital has a team of skilled engineers ready to help design, verify, and implement your FPGA or ASIC solution. Specializing in analog and mixed-signal designs, the team can take your design from requirements capture to customer delivered silicon.

Services

Analog Circuit Design, Digital & Mixed Signal Design, Verification, Concept to Silicon

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Asicland

Republic of Korea

Asicland provides ASIC turnkey services as a TSMC VCA partner. Backed by 400+ tape-out records, we help customers accelerate reliable silicon projects, including tape-out support for design-complete projects.

Services

GDS Hand-off Wafer Production, Spec-in services, Front-end & Back-end Design, Foundry Manufacturing, Packaging, Test & Reliability

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