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Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
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Design Services, Foundry Access, Custom IP, Turnkey Solution, makeChip Hosted Design Service Platform
0.4V Standard Cell Library for 22FDX (22nm FDSOI), Adaptive Body Bias Solution for 22FDX (22nm FDSOI)
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Turnkey ASIC / SOC Development, Technology Development Platform, Technology Development Platform, Analog Circuit Design, Integrated Circuit Layout, Digital Design (RTL Design) and Verification, Digital Physical Design
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SoC Design, Supply Chain Management, ASIC Services, FPGA Design
Processor IP, Digital and Analog IP
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PHYSICAL LAYOUT, VERIFICATION, MODELING, PDK DEVELOPMENT, LIBRARY (LAYOUT/ CHAR), EMBEDDED SERVICES
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