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QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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Bruco Integrated Circuits

The Netherlands

Bruco IC is a European fabless analog, mixed-signal and high-voltage IC Design Service company, offering exclusive solutions for the automotive, ISM and consumer market.

Services

Smart Integrated Power, Wireless Communications, RF-Energy, Characterization and Testing, EDA, Consultancy and Training Services, Supply Chain Management, Certifications

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iNPACK

Israel

Complete OSAT solution: Single Die, MCM, Packaging Design, Substrates and Miniaturized PCBs, 3D Packaging, Test Services, Full Turnkey.

Services

Substrate and Packaging Design, Advanced Packaging Assembly, Substrate Manufacturing, Packaging Services, Full Turn Key

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Greenvity Communications

USA

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

Services

IP Licensing, Mixed-Signal ASIC Design and Customization

IP Cores

HomePlug Green PHY Powerline Communication (HPGP PLC) for Electric Vehicle (EV) Charging System and Automotive, ZigBee Wireless at 2.4GHz, Sub-Gigahz RF Transceiver (programmable 400MHz – 1GHz)

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Fraunhofer Institute for Integrated Circuits IIS

Germany

As one of the leading independent fabless IC-Design institutions in Europe, Fraunhofer IIS offers turnkey solutions for customized mixed-signal ASICs and integrated sensor systems with over 30 years of experience.

Services

Analog and Mixed-Signal Circuits, Digital Systems and Data Processing, Wireline Communications, Radio Frequency Integrated Circuits, ASIC Foundry Services, Integrated Sensor Systems

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