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Full Turn-key, Semiconductor Test board Design and Simulation, PCB Manufacture and Assembly, Test Development, Wafer Probe solutions, Burn-in Systems
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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SiPass Silicon Platform as a Service, System in Package (SiP) Turnkey Service, ChipStarter Multi-Client ASIC Programs
Analog and Mixed Signal IP, Graphic and Peripheral IP, Interface Controller & PHY IP, Memory and Logic Library IP, Multimedia & Wireless Communication IP, Processor & Microcontroller IP
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Our Capabilities, Flip-chip capabilities, Dealing with larger scale dies, COTS and custom solutions to meet the toughest expectations, Upholding the highest quality standards, System in package
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Advanced Logic - 40nm, 65/55nm, Mature Logic - 90nm, 0.13um/0.11um, Mature Technology 0.18μm, 0.35μm, Non-Volatile Memory, Analog/Power, Turnkey Services
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