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USA
Tessolve is the market leader in providing engineering solution for silicon and systems development. We offer a unique combination of both pre-silicon and post silicon expertise to provide an efficient turnkey solution for silicon bring up, spec to product.
Custom Silicon, Design Verification, Physical Design , Design for Test (DFT) , Analog & Mixed Signal (AMS) Design, Embedded & Product Engineering Services
View vendor pageUSA
Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.
Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)
View vendor pageIsrael
Beckermus Technologies (founded in 1998) provides full assembly and packaging services for Microelectronics, Micro Optics and Photonics.
Microelectronic Assembly Services, ectro-Optics and Photonics Assembly Services , Electro Optical Design , Supply Chain Services , Wafer Level Services
View vendor pageChina
Peilun is a worldwide ASIC design service provider, business model including ASIC turnkey solution, or FPGA to ASIC, or IP/customization.
SoC Turnkey Service, IP or chip customization, SOC design platform
View vendor pageBelgium
MinDCet specializes in high-voltage, mixed-signal and power ASIC design and possesses internal production testing facilities for comprehensive solutions .
ASIC Design, ASIC Production Testing, Measurement Systems
GaN Gate Driver, SiC Gate Driver
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