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QP Technologies

QP Technologies

USA

QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.

Services

IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation

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CMC Microsystems

CMC Microsystems

Canada

CMC helps researchers and industrial users develop innovations in microsystems and nanotechnologies.

Services

Fabrication Services, CAD Services, R&D Services

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Struent Semiconductors

Struent Semiconductors

India

Struent Semiconductors is a Semiconductors startup based out of India, offering turnkey, Time & Material and custom business models for ASIC/SoC development, specializing in low-power and Lower Technology nodes.

Services

Spec2parts, FPGA Prototyping & Validation, Derivative Chips, Automotive Chips, Chiplets, IP Hardening

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Packet Digital LLC

Packet Digital

USA

Packet Digital has a team of skilled engineers ready to help design, verify, and implement your FPGA or ASIC solution. Specializing in analog and mixed-signal designs, the team can take your design from requirements capture to customer delivered silicon.

Services

Analog Circuit Design, Digital & Mixed Signal Design, Verification, Concept to Silicon

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Able

Able Electronics

China

Analog, digital, SOC, ASIC wafer and IC testing, SOP/ESOP packaging, fingerprint strip testing, and wafer to COB/PCBA mass production.

Services

Wafer Processing, Test Services, COB/COF/MCM, SMT & Module Assembly, IC Packaging

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