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USA
QP Technologies provides wafer prep, prototype and small-volume IC packaging and assembly services. We specialize in delivering full turnkey solutions.
IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
View vendor pageUSA
Full turn-key solution and service provider specializing in package design, package assembly, qualification/upscreening, and RF/Electrical testing.
Package Design Services, Package Assembly Services, High Temperature Design and Package Assembly, Electrical Test and Device Characterization, Wafer Probe, Device Qualification
View vendor pageIsrael
ATS Engineering provides an all-around solutions to meet the wide range of customer Test and Qualification requirements.
Testing, Qualification & Reliability , Failure Analysis , mmWave Automotive / 5G Device Testing – Up to 81 GHz
View vendor pageUSA
Green Mountain Semiconductor provides full custom circuit design and layout services, from individual expert contracting to turn-key product development.
Circuit Design, Product Development, Memory products, IP and consulting, Test Consulting
View vendor pageFrance
SEMICONDUCTORS BACK-END SERVICES: IC’s Testing, IC’s Packaging, IC’s qualification-Reliability, IC’s Supply Chain and PCB Design and Fabrication.
Semiconductors Industrialisation and Production Services, SEMICONDUCTORS IC’s TEST, IC’s PACKAGING, RELIABILITY QUALIFICATION, PCB Design, Fabrication, Assembly
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