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IC Packaging, IC Assembly, Advanced Assembly, Substrate Design & Development, Wafer Preparation
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ASIC Design, ASIC Production Testing, Measurement Systems
GaN Gate Driver, SiC Gate Driver
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Development and Process Engineering, High Standard of Technological Equipment, Wafer Back-End Services
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ASIC Design, Embedded Algorithms Design, Wafer Testing, Packaging , Quality
High-Voltage IP Cores, Analog IP Cores , Digital IP Cores
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IC and Board Level Reliability, Failure Analysis & Eng Samples Preparation, FIB Circuit Edits Down to 3nm Process and Wafer Surface , Analog Design, ASIC Design and Supply Chain
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