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IBM Canada Ltd

Canada

IBM in Bromont is a world leader in semiconductor packaging technology and now known for our next generation photonic solutions.

Services

Advanced packaging Services, Semiconductor test services, Mechanical, electrical and thermal modeling, Analytical services, reliability and failure analysis

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TTI Company

Taiwan Technology Innovations

Taiwan

Taiwan Technology Innovations (TTI) provide quality and cost-effective outsourced semiconductor assembly and testing services to customer.

Services

Packaging Support List, Tests Services

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EASii IC

France

EASii IC is a design house developing high performances ASIC, from 0.35µm down to 10nm, including FD-SOI.

Services

ASIC design, ASIC verification, System validation and industrialization , Full turnkey

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Device Engineering

Device Engineering Incorporated

USA

Device Engineering is a Tempe, AZ, USA-based design and manufacturing facility specializing in Analog and Mixed-Signal Integrated Circuits.

Services

Analog & Mixed Signal IC Design Services – Sample Capabilities, Design & Layout Tools, RF ASIC Design & Wireless Integrated Circuits, RF ASIC Design Tools, Analog Semi-Custom Arrays (700 Series), Analog Semi-Custom Arrays (Data Archive)

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Greenvity Communications

Greenvity Communications

USA

Greenvity licenses HPGP PLC for automotive and RF transceivers for industrial IoT and provides custom mixed-signal & RF design services.

Services

IP Licensing, Mixed-Signal ASIC Design and Customization

IP Cores

HomePlug Green PHY Powerline Communication (HPGP PLC) for Electric Vehicle (EV) Charging System and Automotive, ZigBee Wireless at 2.4GHz, Sub-Gigahz RF Transceiver (programmable 400MHz – 1GHz)

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